EPO-TEK® 353ND
Low Outgassing Optical Epoxy
High Temperature Resistance & Low outgassing Epoxy Meeting NASA ASTM E595 & Telcordia GR-1221.
EPO-TEK® 353ND-T
Thixotropic Optical Epoxy Adhesive
Highly thixotropic epoxy with non-flowing properties and high temperature resistance.
EPO-TEK® 377H
Graphite Filled Bonding Epoxy
Graphite-filled, High Temperature Epoxy designed for ESD/EMI shielding of semiconductor devices and electronics. It can be used in many electronic industries like consumer, military, and optical/OEM /fiber optics. It is an electrically conductive version of EPO-TEK® 377.
EPO-TEK® 730-110
Thermally and Electrically Insulating Epoxy
Room temperature-curing, thermally and electrically insulating epoxy.
EPO-TEK® EK1000
Conductive Silver Filled Adhesive
High thermal conductive silver filled adhesive.
EPO-TEK® H20E
Silver Filled Electrically Conductive Epoxy
100% solids silver-filled epoxy system for chip bonding in microelectronic and optoelectronic.
EPO-TEK® H20E-MP
Electrically Conductive Silver Epoxy
Low outgassing silver epoxy meeting MIL-STD 883 /5011 and NASA ASTM E595.
EPO-TEK® H20S
Silver Conductive Epoxy
100% solids silver-filled epoxy system for chip bonding in microelectronic and optoelectronic
EPO-TEK® H35-175MP
Low Outgassing Silver Epoxy
Low outgassing silver Epoxy meeting MIL-STD 883 /5011 and NASA ASTM E585.
