EPO-TEK® OD1001
Thermally Conductive Epoxy
This single component epoxy is designed for low stress and semiconductor and electronics packaging. Low Tg, several weeks of pot lif and low modulus are a few of its traits.
EPO-TEK® OD1361
Underfill Epoxy
Optically opaque epoxy specially designed as the dam component for dam and fill applications in combination with either EPO-TEK® 121-136-3 or EPO-TEK® 121-36-4 fill formulations. It can be used for adhesive, sealing, and encapsulation applications in semiconductor, electro-optics,...
EPO-TEK® OE121
Underfill Epoxy Adhesive
Optically clear, low stress, capillary grade semiconductor underfill. It is clear and colorless and capable of curing at low temperatures in the range of 23ºC to 80ºC, suggested for opto-device flip chip packaging. It can also be used...
EPO-TEK® OE121 Black
Underfill Epoxy Adhesive
Low temperature curing epoxy adhesive designed for semiconductor flip chip underfill. It is color coded black for visual ID during the underfilling process. It may also be used for adhesive, potting, sealing, and encapsulation applications found within the...
EPO-TEK® OE138
High Temperature Thixotropic Epoxy
Two component epoxy with intermediate viscosity range between EPO-TEK® 353ND and EPO-TEK® 353ND-T. It is designed for semiconductor glob top applications, as well as use in medical and fiber optic industries.
EPO-TEK® OE145-4
Nonconductive Adhesive
Slightly thixotropic version of 302-3M designed to meet European regulatory requirements. It is a two component epoxy used for optical, fiber optic, and semiconductor applications. This epoxy is good for adhesive joining, sealing, potting, or as a coating.
EPO-TEK® OE145-5
Nonconductive Adhesive
A thixotropic version of 302-3M designed to meet European regulatory requirements. It is a two component slightly thixotropic epoxy used for optical, fiber optic, and semiconductor applications. This epoxy is good for adhesive joining, sealing, potting, or as...
EPO-TEK® OE145-7
Nonconductive Adhesive
Thixotropic version of EPO-TEK® 302-3M designed to meet European regulatory requirements. It is a two component epoxy used for optical, fiber optic, and semiconductor applications. Ideal for adhesive joining, sealing, potting, or as a coating.
EPO-TEK® OE175-2
Hight Temperature Epoxy
Two component, high temperature epoxy designed for semiconductor, hybrid, fiber optic, and medical applications. It is a modified alternative to EPO-TEK® 375 with improved wetting.
