EPO-TEK® OG133-7
Flexible UV Cure
This is a single component, UV curable flexible epoxy adhesive/encapsulant designed for semiconductor and opto-electronic packaging.
EPO-TEK® OG133-8
UV Curable Epoxy
A single-component, thixotropic flexible epoxy/encapsulant designed for semiconductor and opto-electronic packaging. Glob top over IC and wire bonds, as well as low-stress bonding of fiber optic components, are typical applications.
EPO-TEK® OG142
UV & UV Hybrid
Single component, UV curable epoxy designed for adhesive, sealing, and encapsulating applications found in semiconductor, electro-optics, fiber optics, medica, and scientific/OEM industries.
EPO-TEK® OG142-112
UV Cure Optical Epoxy
This single component, low viscosity epoxy is designed for adhesive sealing and encasulating fiber optic and opto-clectronic packaging applications.
EPO-TEK® OG142-112LH
UV Curable Epoxy Adhesive
Low halogen version of OG142-112, single component, low viscosity, UV curable epoxy for adhesive sealing and encapsulating fiber optic and optoelectronic packaging applications.
EPO-TEK® OG142-87
Fiber Optic Epoxy Adhesive
Single component, low viscosity, UV curable epoxy for adhesive sealing and encapsulating fiber optic and optoelectronic packaging application.
EPO-TEK® OG148
UV & UV Hybrid
Single component, UV curable epoxy designed for adhesive, sealing, and encapsulating applications found in semiconductor, electro-optics, fiber optics, medical, and scientific/OEM industries. It is a clear, high Tg epoxy.
EPO-TEK® OG154-1
UV Optical Cure
A single compound UV curable epoxy adhesive for the semiconductor, opto-electronics, medical, and scientific OEM industry.
EPO-TEK® OG159-2
Epoxy-Based Thermal Post-Cure
EPO-TEK® OG159-2 is a single component, high-viscosity, UV-curable epoxy for bonding glass plates in display applications. It’s thixotropic, moisture-resistant, and includes 1 mil glass beads for bond line control.
