EPO-TEK® T7109
Thermal Heatsink Adhesive
Thermally conductive epoxy designed for die attach and heat-sinking applications found in the semiconductor, hybrid microelectronics, and optical industries.
EPO-TEK® T7109-18
Flexible Electrically Insulating Epoxy Paste
A flexible, electrically insulating epoxy paste designed for low stress and heat dissipation applications.
EPO-TEK® T7110
Thermally Conductive Electrically Insulating Epoxy
Thermally conductive, electrically insulating epoxy designed for heat sinking electronics and semiconductors. It may be used as an adhesive, potting, or encapsulation material, for industries such as consumer or optics.
EPO-TEK® TE109-15
Thermally Conductive Epoxy
Longer pot-life version of EPO-TEK® T7109, thermally conductive, electrically insulating epoxy for heat sinking applications.
EPO-TEK® TZ101
Thermally Conductive Adhesive
Single component, electrically insulating, thermally conductive epoxy adhesive designed for heat-sinking of semiconductors, hybrids, electronics, and optics.
