EPO-TEK® H37-MP
Electrically & Thermally Conductive Epoxy
Low stress and low temperature cure temperature version of H35-175MP.
EPO-TEK® H67-MP
Thermally Conductive Adhesive
Single component, thermally conductive epoxy for hybrid die and component attach. It can also be used for semiconductor and high temperature ceramic and vacuum packaging.
EPO-TEK® H70E
Thermally Conductive Adhesive
Two component, thermally conductive, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronics applications.
EPO-TEK® HYB-353ND
UV Hybrid
A single component, high temperature hybrid epoxy for semiconductor, and fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking.
EPO-TEK® HYB-353ND-HV
UV Hybrid
A single component, high temperature epoxy for semiconductor, hybrid, and fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking. It is a higher viscosity version of...
EPO-TEK® HYB-353ND-LV
UV Hybrid
A single component, high temperature hybrid epoxy for semiconductor and fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking. It is a lower viscosity version of...
EPO-TEK® HYB-353ND-TX2
UV Hybrid
A single component, high temperature hybrid epoxy for semiconductor, and fiber optic applications.
EPO-TEK® MED-301
Medical Grade Epoxy
ISO 10993 Medical grade low viscosity clear epoxy with high spectral transmission.
EPO-TEK® MED-301-2
Medical Grade Epoxy
ISO 10993 Tested/Fully Compliant, Clear and colorless, Low viscosity, room temperature curing epoxy.
