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109 matches
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109 matches
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EPO-TEK® H70E

EPO-TEK® H70E

Electrically Insulating Epoxy

Two component, thermally conductive, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronics applications.

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EPO-TEK® H70S

EPO-TEK® H70S

Thermally Conductive Epoxy

Thermally conductive and electrical insulating epoxy with a smooth, flowable consistency, designed for chip bonding. Modified version of EPO TEK® H70E, designed primarily for die stamping 

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EPO-TEK® HYB-353ND

EPO-TEK® HYB-353ND

UV Hybrid

A single component, high temperature hybrid epoxy for semiconductor, and fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking. 

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EPO-TEK® HYB-353ND-HV

EPO-TEK® HYB-353ND-HV

UV Hybrid Curing Epoxy

A single component, high temperature epoxy for semiconductor, hybrid, and fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking. It is a higher viscosity version of...

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EPO-TEK® HYB-353ND-LV

EPO-TEK® HYB-353ND-LV

Low Viscosity UV Hybrid Epoxy

A single component, high temperature hybrid epoxy for semiconductor and fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking. It is a lower viscosity version of...

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EPO-TEK® HYB-353ND-TX2

EPO-TEK® HYB-353ND-TX2

UV Hybrid Epoxy

A single component, high temperature hybrid epoxy for semiconductor, and fiber optic applications. 

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EPO-TEK® MED-301

EPO-TEK® MED-301

Low Viscosity Medical Grade Epoxy

ISO 10993 Medical grade low viscosity clear epoxy with high spectral transmission. 

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EPO-TEK® MED-301-2

EPO-TEK® MED-301-2

Optically Transparrent Medical Grade Epoxy Resin

ISO 10993 Tested/Fully Compliant, Clear and colorless, Low viscosity, room temperature curing epoxy.

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EPO-TEK® MED-353ND

EPO-TEK® MED-353ND

Medical Grade Epoxy Adhesive

ISO 10993 Medical grade high temperature high reliability epoxy. It has decades of use and reliability in medical device designs worldwide. 

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