EPO-TEK® 375-T - Optical Epoxy

ASI 388 Electronic Grade RTV Silicone is a one part, moisture cure sealant that cures to form a tough, durable, flexible rubber that is deal for bonding, sealing, encapsulating and protecting electronic parts.Once cured, ASI 388 will withstand...

ULTRABOND® 1300-FG is a two-component, fast-setting adhesive system that offers exceptional strength in anchoring and doweling applications. It is perfect for bonding applications that require a quick turn-around. It may be used in temperatures between 40 °F -...

A premium quality, solvent based, high performance, fast drying, polystyrene insulation adhesive. DP 2585 is water resistant and temperature resistant to 180° F. It is ideal for bonding polystyrene, polyisocyanurate and phenolic foam insulation sheets and block without...

Thermally conductive and electrical insulating epoxy with a smooth, flowable consistency, designed for chip bonding. Modified version of EPO TEK® H70E, designed primarily for die stamping 

ASI 5900 Fast Grab Hybrid Adhesive uses ASI’s innovative hybrid technology to develop immediate green strength to fixture substrates while the adhesive cures and provides a long-term, durable bond. ASI 5900 is 100% solids.It will not shrink and...

Available in 2" and 3" sizes