EPO-TEK® 353ND-T1 - Nonconductive Adhesive

A medium viscosity, premium quality, Low VOC, water based, high strength, quick drying, low odor weather barrier coating. DP 5050 is recommended for indoor and outdoor use where a breather mastic is required. It is used for bonding...

Single component, thermally conductive epoxy for hybrid die and component attach. It can also be used for semiconductor and high temperature ceramic and vacuum packaging.

A single component, high temperature hybrid epoxy for semiconductor and fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking. It is a lower viscosity version of...

General purpose, semi flexible thixotropic adhesives for high CTEsubstrates available in either a light or heavy paste.

Low temperature curing epoxy adhesive designed for semiconductor flip chip underfill. It is color coded black for visual ID during the underfilling process. It may also be used for adhesive, potting, sealing, and encapsulation applications found within the...

EPX50-RC (Rapid Cure) delivers fast, high-strength performance for demanding infrastructure applications. This moisture-insensitive epoxy-urethane overlay meets ASTM C881 / AASHTO M235 Type III and forms a durable, waterproof, anti-skid surface ideal for bridge decks, elevated slabs, and high-friction...