EPO-TEK® 360 - Low Viscosity, Optical Epoxy

Single component, thermally conductive epoxy for hybrid die and component attach. It can also be used for semiconductor and high temperature ceramic and vacuum packaging.

Versatile variable mix ratio epoxy with high peel strength and outstanding thermal shock, impact, and vibration resistance. Available in regular, non sag, and high viscosities.

MIRACLE BOND® REPAIR EPOXY is a multi-purpose, rapid cure, bonding, and repair adhesive. Its specially formulated, non-sag property is ideal for bonding most materials and perfect for both overhead and vertical repairs, while still being easily dispensed from...

Available in 2" and 3" sizes

ASI 335 Neutral Cure RTV Silicone is a one-part, non-slump, moisture cure sealant/adhesive that cures to form a tough rubber with long-term flexibility and durability.Due to the formulation, ASI 335 offers advanced adhesion to a variety of surfaces...

An ISO 10993 Medical grade, single component, UV hybrid curing epoxy for semiconductor, and fiber optic applications.