EPO-TEK® B13181 - Thermally Conductive Epoxy

Single component, low viscosity, UV curable epoxy for adhesive sealing and encapsulating fiber optic and optoelectronic packaging application. 

ASI 57 Hybrid Class 50 Hybrid Sealant and Adhesive is a one-part, low odor, no-sag polyether sealant that uses ASI’s innovative hybrid technology to produce a material that is ideal for a wide range of applications where a...

For anchoring threaded rod and rebar, railings, sign posts and parking meters, or patching holes and cracks in roads and sidewalks, ULTRABOND® HARD-ROK contains no metals to cause rust or stains and is suitable for interior or exterior...

CRACKBOND® V65 HI-MOD (formerly known as CRACKBOND® HEALER/SEALER) is a two-component, deep penetrating, fast cure, high strength epoxy coating that will reduce intrusion of moisture and water soluble materials into concrete. The ultra-low viscosity (65 cP) allows superior...

Thermally conductive epoxy designed for die attach and heat-sinking applications found in the semiconductor, hybrid microelectronics, and optical industries.

Thermally conductive and electrical insulating epoxy with a smooth, flowable consistency, designed for chip bonding. Modified version of EPO TEK® H70E, designed primarily for die stamping