EPO-TEK® B13181 - Thermally Conductive Epoxy

Single component, UV curable epoxy adhesive and encapsulant, designed for PCB and circuit assembly applications found in semiconductor, computer, and scientific/OEM industries.

Available in 2" and 3" sizes

Smooth, non-sag, non-abrasive consistency ideal for use in bulk dispensing systems without adverse wear on pumps. Extensive DOT approvals. Available in cartridges and bulk with ATC. 

A premium quality, solvent based, high performance, fast drying, polystyrene insulation adhesive. DP 2585 is water resistant and temperature resistant to 180° F. It is ideal for bonding polystyrene, polyisocyanurate and phenolic foam insulation sheets and block without...

EP50-OVERLAY is a solvent-free, moisture-insensitive, 100% solids, low-modulus, two-component polymer designed primarily for bonding skid-resistant overlays.

Concrete weare surface extender with anti-scaling treatment.