EPO-TEK® EJ2189 - Electrically Conductive Epoxy

Potting and adhesive UV resin with very low viscosity that passes ASTM E595 low outgassing.

100% solids silver-filled epoxy system for chip bonding in microelectronic and optoelectronics.

Ultra clear epoxy with an RI of 1.523 at 589 nm. High purity grade polymer system with a bubble free and glass smooth finish. Available as lower viscosity version 20-3302NCLV.

ASI Compound 70 Multi-Purpose Silicone Grease is a moisture resistant, non-curing paste which retains its consistency and properties over a temperature range of -70°F to 400°F.This stiff, tacky compound is non-melting and retains its properties over extended periods...

Aluminum filled epoxy with excellent thermal conductivity that passes ASTM E595 NASA low outgassing.

EP-MV is a 100% solids, two-component, high-modulus, medium-viscosity, moisture-insensitive structural epoxy adhesive designed for bonding freshly mixed concrete to hardened concrete, for bonding hardened concrete to hardened concrete and other materials, and as a binder for epoxy mortars....