EPO-TEK® EJ2189 - Electrically Conductive Epoxy

EPO-TEK® HYB-353ND-HV

UV Hybrid Curing Epoxy

A single component, high temperature epoxy for semiconductor, hybrid, and fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking. It is a higher viscosity version of...

Dextrin Adhesives

Evans Adhesive dextrin products provide high-performance bonding for packaging, labeling, and paper converting. Known for their versatility, they offer consistent adhesion and easy application across a range of industrial uses.

ASI 388

Electronic Grade RTV Silicone

ASI 388 Electronic Grade RTV Silicone is a one part, moisture cure sealant that cures to form a tough, durable, flexible rubber that is deal for bonding, sealing, encapsulating and protecting electronic parts.Once cured, ASI 388 will withstand...

EPO-TEK® H21D

High Tg Silver Epoxy

High glass transition temperature silver epoxy designed for chip bonding in microelectronic and optoelectronic applications. 

ULTRABOND® HS-1CC

High Strength Anchoring Epoxy

NSF/ANSI 61 & 372 CertifiedULTRABOND® HS-1CC is the world’s first anchoring epoxy formulated to be IBC/IRC compliant in both bulk and cartridge delivery systems. For use in dry, damp, water-filled and submerged applications, even in the most extreme...

EPO-TEK® H20S

Silver Conductive Epoxy

100% solids silver-filled epoxy system for chip bonding in microelectronic and optoelectronics.