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Polyurethane Adhesive
10-2080 is a general purpose, semi rigid polyurethane adhesive for bonding a wide variety of plastic and metal substrates. Its flexibility allows bonding to substrates with high coefficients of thermal expansion.

Heat Resistant Stencil Adhesive
Tough stencil adhesive with excellent chemical and heat resistance.

Thermal Heatsink Adhesive
Thermally conductive epoxy designed for die attach and heat-sinking applications found in the semiconductor, hybrid microelectronics, and optical industries.

Low Outgassing Optical Epoxy
High Temperature Resistance & Low outgassing Epoxy Meeting NASA ASTM E595 & Telcordia GR-1221.

Thermally Conductive Epoxy
Single component, thermally conductive epoxy for hybrid die and component attach. It can also be used for semiconductor and high temperature ceramic and vacuum packaging.

Thermally Conductive Potting Epoxy
Potting and encapsulating UL 94 V-0 listed epoxy with a CTI > 600 Volts. UL File Number E235584.
Polyurethane Adhesive
10-2080 is a general purpose, semi rigid polyurethane adhesive for bonding a wide variety of plastic and metal substrates. Its flexibility allows bonding to substrates with high coefficients of thermal expansion.
Heat Resistant Stencil Adhesive
Tough stencil adhesive with excellent chemical and heat resistance.
Thermal Heatsink Adhesive
Thermally conductive epoxy designed for die attach and heat-sinking applications found in the semiconductor, hybrid microelectronics, and optical industries.
Low Outgassing Optical Epoxy
High Temperature Resistance & Low outgassing Epoxy Meeting NASA ASTM E595 & Telcordia GR-1221.
Thermally Conductive Epoxy
Single component, thermally conductive epoxy for hybrid die and component attach. It can also be used for semiconductor and high temperature ceramic and vacuum packaging.
Thermally Conductive Potting Epoxy
Potting and encapsulating UL 94 V-0 listed epoxy with a CTI > 600 Volts. UL File Number E235584.


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