EPO-TEK® EK1000 Silver Filled Adhesive

Features

Exceptional thermal and electrically conductivity
Low viscosity and smooth thixotropic paste silver filled epoxy (thixotropic 3.6)
Thermal conductivity up to 35.5 W/mK at recommended curing schedule
Storage modulus of 273,528 psi
Versatile in processing/ application techniques

Applications

Concentrator PV solar cell chip attach
Thermal management for heat generate chip or components
High brightness LED die attach
Available in a MIL-STD_883 Test Method 5011 version - EK1000-MP for demanding military applications

Downloads

Type

Document Name

File Size

Technical Data Sheet

Document Name epotek®

File Size 602.8 KB

View

Safety Data Sheet

Document Name EPO-TEK® EK1000

File Size 265.2 KB

View

Certifications

Brand:

Epoxy Technology

Technology:

Epoxy

Application:

Consumer Electronics and PCBA Datacom and Telecom E-mobility Microelectronics/Semiconductors Off-shore Drilling Optical Sensors and Camera Modules Radar Systems, Navigation and Sensors Solar/Wind

Market:

Automotive and Transportation Electronics Oil and Renewable Energy Optical, Datacom and Telecom

Function:

Bonding Electrical Connection High Temperature Sealing Thermal Transfer

Available Packaging

Notes

Contact our customer service or sales representative for more information.

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Get in touch to learn more

Speak to us on 1-978-667-3805

EPO-TEK® EK1000 - Electrically Conductive Silver Filled Adhesive

Features

Applications

Downloads

Certifications