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High thermal conductive silver filled adhesive.
Contact our customer service or sales representative for more information.
Electrically & Thermally Conductive Epoxy
Low stress and low temperature cure temperature version of H35-175MP.
Electrically & Thermally Conductive Epoxy
Low outgassing silver Epoxy meeting MIL-STD 883 /5011 and NASA ASTM E585.
Optical Grade Epoxy
Highly thixotropic epoxy with non-flowing properties and high temperature resistance.
Optical Grade Epoxy
Room temperature curing epoxy featuring very low viscosity, clear and excellence optical-mechanical properties.
UV Curable
Low viscosity, clear UV aliphatic urethane acrylate for bonding, coating, or encapsulating.
Underfill Epoxy
Low temperature curing epoxy adhesive designed for semiconductor flip chip underfill. It is color coded black for visual ID during the underfilling process. It may also be used for adhesive, potting, sealing, and encapsulation applications found within the...
Electrically & Thermally Conductive Epoxy
Low stress and low temperature cure temperature version of H35-175MP.
Electrically & Thermally Conductive Epoxy
Low outgassing silver Epoxy meeting MIL-STD 883 /5011 and NASA ASTM E585.
Optical Grade Epoxy
Highly thixotropic epoxy with non-flowing properties and high temperature resistance.
Optical Grade Epoxy
Room temperature curing epoxy featuring very low viscosity, clear and excellence optical-mechanical properties.
UV Curable
Low viscosity, clear UV aliphatic urethane acrylate for bonding, coating, or encapsulating.
Underfill Epoxy
Low temperature curing epoxy adhesive designed for semiconductor flip chip underfill. It is color coded black for visual ID during the underfilling process. It may also be used for adhesive, potting, sealing, and encapsulation applications found within the...
Speak to us on 1-978-667-3805
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