EPO-TEK® EK1000-1MP - Electrically Conductive, Silver Epoxy

Quick set, thixotropic polyurethane encapsulant with flow control available in TriggerBond®.

Pentra-Finish™ (HG) is an advanced, high-gloss, fast-drying lithium sealer that creates a microfilm on polished concrete, stone, terrazzo, masonry and other cementitious surfaces. This easy-to-use finish increases shine, enhances color and improves resistance against abrasion and stains. Pentra-Finish™...

EP-MV is a 100% solids, two-component, high-modulus, medium-viscosity, moisture-insensitive structural epoxy adhesive designed for bonding freshly mixed concrete to hardened concrete, for bonding hardened concrete to hardened concrete and other materials, and as a binder for epoxy mortars....

Low temperature curing epoxy adhesive designed for semiconductor flip chip underfill. It is color coded black for visual ID during the underfilling process. It may also be used for adhesive, potting, sealing, and encapsulation applications found within the...

Rapid curing, polyurea control joint filler designed for heavy duty traffic and freezer applications. Low viscosity, self leveling and allows for 10-15% movement of installed joint width. Available in cartridges and bulk. 

Two component, thermally conductive epoxy, formulated with a very fine boron-nitride filler particle. Also available in a single component frozen syringe.