Certifications
Related Products

50-3152FR
Thermally Conductive Potting Epoxy
Potting and encapsulating UL 94 V-0 listed epoxy with a CTI > 600 Volts. UL File Number E235584.

EP100-SEAL
Epoxy Concrete Healer/Sealer
EP100-SEAL is a highly penetrating, two-component epoxy healer/sealer. Its rapid cure time allows traffic to re-open in less than six hours.

C-CLEAN100
Concrete Stripper and Cleaner
C-CLEAN100 is a heavy-duty stripper and degreaser that is used for general cleaning and degreasing of concrete surfaces, tools and equipment.

CONVERGENT Pentra-Clean™ (DC)
Multi-Surface, Acid-Free Daily Cleaner
Pentra-Clean™ (DC) Daily Cleaner easily removes stains, dirt, grease and grime from concrete, terrazzo, natural stone and tile floor surfaces. This product is easy to use, leaves no film or residue and has a neutral pH with no...

EPO-TEK® OE121
Underfill Epoxy Adhesive
Optically clear, low stress, capillary grade semiconductor underfill. It is clear and colorless and capable of curing at low temperatures in the range of 23ºC to 80ºC, suggested for opto-device flip chip packaging. It can also be used...

EPO-TEK® H21D
High Tg Silver Epoxy
High glass transition temperature silver epoxy designed for chip bonding in microelectronic and optoelectronic applications.
50-3152FR
Thermally Conductive Potting Epoxy
Potting and encapsulating UL 94 V-0 listed epoxy with a CTI > 600 Volts. UL File Number E235584.
EP100-SEAL
Epoxy Concrete Healer/Sealer
EP100-SEAL is a highly penetrating, two-component epoxy healer/sealer. Its rapid cure time allows traffic to re-open in less than six hours.
C-CLEAN100
Concrete Stripper and Cleaner
C-CLEAN100 is a heavy-duty stripper and degreaser that is used for general cleaning and degreasing of concrete surfaces, tools and equipment.
CONVERGENT Pentra-Clean™ (DC)
Multi-Surface, Acid-Free Daily Cleaner
Pentra-Clean™ (DC) Daily Cleaner easily removes stains, dirt, grease and grime from concrete, terrazzo, natural stone and tile floor surfaces. This product is easy to use, leaves no film or residue and has a neutral pH with no...
EPO-TEK® OE121
Underfill Epoxy Adhesive
Optically clear, low stress, capillary grade semiconductor underfill. It is clear and colorless and capable of curing at low temperatures in the range of 23ºC to 80ºC, suggested for opto-device flip chip packaging. It can also be used...


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