EPO-TEK® H20F - Electrically Conductive Adhesive

Fast curing epoxy adhesive with high lap shear strength available in the convenient TriggerBond® packaging.

Low viscosity thermal shock epoxy with a Dielectric Strength of 1857 V/mil.

MIRACLE BOND® REPAIR EPOXY is a multi-purpose, rapid cure, bonding, and repair adhesive. Its specially formulated, non-sag property is ideal for bonding most materials and perfect for both overhead and vertical repairs, while still being easily dispensed from...

For cracked and uncracked concrete, ULTRABOND® HYB-2CC is IBC approved for application in temperatures down to 23 °F. And for jobs where a quick cure rate is required, it will cure completely in 30 minutes at 70 °F. Approved...

Optically clear, low viscosity, 1:1 silicone potting system. Ideal for protection from shock and vibration. 

Flame retardant, UL 94 V-0 listed urethane. Low viscosity and low Tg makes this product ideal for cushioning and protecting sensitive electronics. UL File Number E235584.