EPO-TEK® H20F - Electrically Conductive Adhesive

ASI 6900 Extreme Fast-Grab Hybrid Adhesive grabs and holds substrates within just a few seconds, making it ideal for holding heavy objects in place while adhesive cures to form a long-term, durable bond. This reduces or eliminates the...

Highly thixotropic epoxy with non-flowing properties and high temperature resistance. 

With slower curing for the warmest southern climates, ULTRABOND® 2 provides a long working time of 28 minutes @ 75°F (24°C) and in-service temperatures to 180°F. For anchoring threaded rod into concrete, ULTRABOND® 2 has a 1:1 mix...

Water resistant, room temperature cure adhesive that meets FDA regulations Sections 175.105 and 175.300 permitting use in "indirect" food contact applications.

Pentra-Sil® (H) provides efficient and economic maximum densification for large format industrial warehouses and data centers. This lithium silicate “time of placement” reactive densifier significantly reduces wear due to abrasion while eliminating concrete dusting, and makes the surface...

Pentra® (PCF) is an industry-leading liquid pore and micro-crack filler for concrete grinding and polishing. This reactive treatment mixes with the dust created during concrete grinding to fill pinholes, microcracks and other imperfections in the concrete surface. It...