Features
- Silver-filled epoxy with a smooth, thixotropic consistency (thixotropic 5.0)
- Designed primarily for die stamping and dispensing techniques for chip bonding
- Suit for use in high speed epoxy chip bonding systems
- Storage modulus 339,720 psi
Applications
- Hybrid/hermetic packages (e.g. die and chip bonding in DIP and TO Cans)
- Semiconductor IC Packaging ( e.g. die attach)
- Stress sensitive applications (e.g. flex circuitry, quartz crystal oscillators and other stress sensitive chips bonding)
- Microelectronics (e.g. EMI/Rf shielding)
Downloads
Available Packaging
Notes
Contact our customer service or sales representative for more information.
Related Products

EPO-TEK® HYB-353ND
UV Hybrid
A single component, high temperature hybrid epoxy for semiconductor, and fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking.

EPO-TEK® OG116-31
UV Curable Epoxy
Single component, UV curable epoxy adhesive and encapsulant, designed for PCB and circuit assembly applications found in semiconductor, computer, and scientific/OEM industries.

EPO-TEK® 301
Optical Grade Epoxy
Room temperature curing epoxy featuring very low viscosity, clear and excellence optical-mechanical properties.

EPO-TEK® HYB-353ND-TX2
UV Hybrid
A single component, high temperature hybrid epoxy for semiconductor, and fiber optic applications.

EPO-TEK® 353ND-T
Optical Grade Epoxy
Highly thixotropic epoxy with non-flowing properties and high temperature resistance.

EPO-TEK® OG198-54
UV Curable Epoxy
Single component, low viscosity, electrically and thermally insulating shadow curable UV epoxy.
EPO-TEK® HYB-353ND
UV Hybrid
A single component, high temperature hybrid epoxy for semiconductor, and fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking.
EPO-TEK® OG116-31
UV Curable Epoxy
Single component, UV curable epoxy adhesive and encapsulant, designed for PCB and circuit assembly applications found in semiconductor, computer, and scientific/OEM industries.
EPO-TEK® 301
Optical Grade Epoxy
Room temperature curing epoxy featuring very low viscosity, clear and excellence optical-mechanical properties.
EPO-TEK® HYB-353ND-TX2
UV Hybrid
A single component, high temperature hybrid epoxy for semiconductor, and fiber optic applications.
EPO-TEK® 353ND-T
Optical Grade Epoxy
Highly thixotropic epoxy with non-flowing properties and high temperature resistance.
EPO-TEK® OG198-54
UV Curable Epoxy
Single component, low viscosity, electrically and thermally insulating shadow curable UV epoxy.


Get in touch to learn more
Speak to us on 1-978-667-3805
Contact us
EPO-TEK® H20S
Electrically & Thermally Conductive EpoxyLet's talk
We're here to help you create the perfect product.