EPO-TEK® H20S

Features

Silver-filled epoxy with a smooth, thixotropic consistency (thixotropic 5.0)
Designed primarily for die stamping and dispensing techniques for chip bonding
Suit for use in high speed epoxy chip bonding systems
Storage modulus 339,720 psi

Applications

Hybrid/hermetic packages (e.g. die and chip bonding in DIP and TO Cans)
Semiconductor IC Packaging ( e.g. die attach)
Stress sensitive applications (e.g. flex circuitry, quartz crystal oscillators and other stress sensitive chips bonding)
Microelectronics (e.g. EMI/Rf shielding)

Downloads

Type

Document Name

File Size

Technical Data Sheet

Document Name epotek®

File Size 139.9 KB

View

Safety Data Sheet

Document Name H20S

File Size 517.7 KB

View

Certifications

Brand:

Epoxy Technology

Technology:

Epoxy

Application:

Optical Sensors and Camera Modules

Market:

Electronics Optical, Datacom and Telecom

Function:

Bonding Electrical Connection High Temperature Sealing Thermal Transfer

Available Packaging

Notes

Contact our customer service or sales representative for more information.

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EPO-TEK® H20S - Silver Conductive Epoxy

Features

Applications

Downloads

Certifications