Features
- Silver-filled epoxy with a smooth, thixotropic consistency (thixotropic 5.0)
- Designed primarily for die stamping and dispensing techniques for chip bonding
- Suit for use in high speed epoxy chip bonding systems
- Storage modulus 339,720 psi
Applications
- Hybrid/hermetic packages (e.g. die and chip bonding in DIP and TO Cans)
- Semiconductor IC Packaging ( e.g. die attach)
- Stress sensitive applications (e.g. flex circuitry, quartz crystal oscillators and other stress sensitive chips bonding)
- Microelectronics (e.g. EMI/Rf shielding)
Available Packaging
Notes
Contact our customer service or sales representative for more information.
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