EPO-TEK® H27D - Electrically Conductive Adhesive

EPO-TEK® TZ101

Thermally Conductive Adhesive

Single component, electrically insulating, thermally conductive epoxy adhesive designed for heat-sinking of semiconductors, hybrids, electronics, and optics. 

EP-PATCH 7040

High-performance, low-modulus, epoxy patching mortar

EP-PATCH 7040 is a three-component, high-performance, 100% solids, multi-purpose, non-shrink epoxy patching mortar. This low-modulus material offers excellent bond strength and outstanding workability, providing extended working times for higher temperature applications. The EP-PATCH 7040 system combines a high-quality epoxy resin and curing agent...

EPO-TEK® HYB-353ND-HV

UV Hybrid Curing Epoxy

A single component, high temperature epoxy for semiconductor, hybrid, and fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking. It is a higher viscosity version of...

DP 503 HIGH TEMP RED

100% RTV Silicone Sealant

A high-performance HVAC, industrial, commercial, and residential construction grade 100% Acetoxy RTV Silicone adhesive/sealant that can withstand extreme heat while maintaining its physical properties. DP 503 has excellent resistance to aging, weathering, and UV degradation and will provide...

EP-PATCH

Higher-performance, low-modulus, epoxy patching mortar

EP-PATCH is a three-component, high-performance, 100% solids, multi-purpose, non-shrink epoxy patching mortar. It is characterized by high early strength, low modulus, excellent workability and excellent bond strength. The system combines a high-quality epoxy resin and curing agent with an engineered blend of graded...

Dextrin Adhesives

Evans Adhesive dextrin products provide high-performance bonding for packaging, labeling, and paper converting. Known for their versatility, they offer consistent adhesion and easy application across a range of industrial uses.