EPO-TEK® H27D - Electrically Conductive Adhesive

CRACKBOND® 2300 GEL (formerly ULTRABOND® 2300) is a two-component, 100% solids, high-strength epoxy bonding adhesive. It is a solvent free, high modulus, moisture insensitive, non-sag epoxy system. CRACKBOND® 2300 GEL is ideal for use in temperatures from 60°F...

Fast curing, styrene free, acrylic system. Numerous DOT approvals. Available in 10 oz. and 28 oz. cartridges. Browse our selection of anchoring and doweling adhesives for vertical construction and transportation infrastructure. Learn more about cold weather epoxy and...

A UL Classified coating for repairing and encapsulating damaged fiberglass insulation and line set protection from UV degradation. DP 2510/2515 provides a flexible, durable coating which helps to prevent fibers from entering the air stream. It may also...

Versatile variable mix ratio epoxy with high peel strength and outstanding thermal shock, impact, and vibration resistance. Available in regular, non sag, and high viscosities.

Fast curing epoxy adhesive with high lap shear strength available in the convenient TriggerBond® packaging.

Thermally conductive, electrically insulating epoxy designed for heat sinking electronics and semiconductors. It may be used as an adhesive, potting, or encapsulation material, for industries such as consumer or optics.