EPO-TEK® H31D - Electrically Conductive Adhesive

Thermally conductive and electrical insulating epoxy with a smooth, flowable consistency, designed for chip bonding. Modified version of EPO TEK® H70E, designed primarily for die stamping 

Low stress and low temperature cure temperature version of H35-175MP.

Thermally conductive epoxy designed for die attach and heat-sinking applications found in the semiconductor, hybrid microelectronics, and optical industries.

COLORFAST™ Stain is a chemically reactive, Nano-Lithium® enhanced product that creates beautiful, durable colored concrete. High-solids treatment utilizes lithium densifier to harden and protect both interior and exterior slabs. COLORFAST™ Stain is an ideal solution for all construction...

ISO 10993 Medical grade thermally conductive epoxy, electrically insulating, low temperature curing epoxy. Ideal for temperature sensitive devices.  

ASI 12SK Butyl Sealant is a one part, butyl-based sealant formulated to perform better than the average butyl by using synthetic fibers for more flexibility, better adhesion and greater versatility.ASI 12SK provides a long-term seal between all types...