EPO-TEK® H31D - Electrically Conductive Adhesive

Thermally conductive epoxy designed for die attach and heat-sinking applications found in the semiconductor, hybrid microelectronics, and optical industries.

A UL Listed, Low VOC, smooth, water based, high pressure/high velocity duct sealant for commercial and residential supply and return air duct use. The consistency of DP 1015 allows for better coverage and ease of application. It exceeds...

EP-CLEARSEAL is a two-component, moisture-insensitive, self priming, impermeable, high-gloss epoxy sealer that exhibits excellent bond strength. EP-CLEARSEAL uses a cycloaliphatic amine curing system for color retention and chemical resistance.

CRACKBOND® V200 HI-MOD is a two-component, moisture insensitive, high modulus, high strength epoxy healer/sealer deck penetrant, designed to prolong the life of concrete by sealing cracks against moisture and preventing chloride ion intrusion. The super-low viscosity (200 cP),...

ASI 502 100% RTV Silicone is a one-component, moisture cure, acetoxy silicone that cures to form an extremely durable rubber that can withstand a variety of extreme environments.Unlike many organic sealants, ASI 502 is extremely resistant to degradation,...

 10-3001 is a high bond strength epoxy adhesive that yields high peel strength, excellent tensile strength, along with outstanding thermal shock, impact and vibration resistance. This high-performance epoxide adhesive also exhibits outstanding physical, thermal, and electrical insulation properties.