EPO-TEK® H70E-175 - Thermally Conductive Epoxy

100% solids silver-filled epoxy system for chip bonding in microelectronic and optoelectronics.

A premium quality, ZERO VOC, 100% solids, UL Classified, high pressure/high velocity butyl gasket tape for commercial and residential supply and return air duct uses. DP 1040 provides a flexible seal between TDC, TDF and applied flange connections...

CRACKBOND® JF-90 HD is a two component, moisture insensitive heavy duty epoxy joint filler and crack filling material. Its semi-rigid design allows for use in industrial floors exposed to hard-wheeled forklift traffic. It shaves easily and may be...

Pentra-Clean™ (CR) cleans floors by cutting through dirt, grime and residue while using reactive Nano-Lithium® to harden, protect and restore gloss and durability. Cleaning with Pentra-Clean™ (CR) increases the floor’s longevity, reducing maintenance and costly repairs. Ideal for...

Room temperature-curing, thermally and electrically insulating epoxy.

ISO 10993 Medical grade high temperature high reliability epoxy. It has decades of use and reliability in medical device designs worldwide.