EPO-TEK H70E-175 Thermally Conductive Epoxy Adhesive

EPO-TEK® H70E-175 Thermally Conductive Epoxy

EPO-TEK® H70E-175 is a two component, thermally conductive, electrically insulating epoxy adhesive for semiconductor, microelectronic and opto-electronic packaging. It may be used in aluminum heat sinking power devices in the form of hybrid circuits or at the SMD/PCB level.

SDS TDS

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Type

Document Name

File Size

Technical Data Sheet

Document Name EPO-TEK® H70E-175 TDS

File Size 552.2 KB

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Safety Data Sheet

Document Name EPO-TEK® H70E-175 SDS

File Size 293.4 KB

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Certifications

Brand:

Epoxy Technology

Technology:

Epoxy

Market:

Electronics Optical, Datacom and Telecom

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