EPO-TEK® H74-110 - Nonconductive Epoxy Adhesive

Quick set, thixotropic polyurethane encapsulant with flow control available in TriggerBond®.

Two component, moisture insensitive, high modulus, epoxy paste available in cartridges and bulk kits. Ideal as a bonding agent, filler, capping material for crack injection or as a pick-proof sealant. 

A premium quality, UL Listed, Low VOC, fiber reinforced, water based, high pressure/high velocity duct sealant for commercial and residential supply and return air duct use. The consistency of DP 1020 allows for easier sealing of holes and...

2-component polyurethane hybrid formulations. Extreme low viscosity and rapid cure for quick repairs of cracks and spalls in concrete. Find a selection of concrete repair and restoration adhesives for buildings and transportation infrastructure.

Single component, thermally conductive epoxy for hybrid die and component attach. It can also be used for semiconductor and high temperature ceramic and vacuum packaging.

Non-yellowing UV urethane adhesive and encapsulant.