Certifications
Related Products

EPO-TEK® MED-OG198-55
Thixotropic UV Curing Epoxy
ISO 10993 Biocompatible Shadow Cure Capable UV curing epoxy. A translucent cationic/epoxy UV with high viscosity, high Tg, and high strength.

DP 99
Spray Degalvanizer
DP 99 is a degalvanizing spray for use on roll-forming machines, shears, punch press dies and notchers. DP 99 will soften and loosen galvanizing debris while lubricating. Daily use will keep machinery clear of galvanizing build-up. DP 99...

EPO-TEK® HYB-353ND
UV Hybrid
A single component, high temperature hybrid epoxy for semiconductor, and fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking.

CRACKBOND® 2300 GEL
High Strength Gel Bonding Adhesive
CRACKBOND® 2300 GEL (formerly ULTRABOND® 2300) is a two-component, 100% solids, high-strength epoxy bonding adhesive. It is a solvent free, high modulus, moisture insensitive, non-sag epoxy system. CRACKBOND® 2300 GEL is ideal for use in temperatures from 60°F...

EP-PATCH
Higher-performance, low-modulus, epoxy patching mortar
EP-PATCH is a three-component, high-performance, 100% solids, multi-purpose, non-shrink epoxy patching mortar. It is characterized by high early strength, low modulus, excellent workability and excellent bond strength. The system combines a high-quality epoxy resin and curing agent with an engineered blend of graded...

ULTRABOND® EPX-3CC
High Performance Epoxy Anchor Adhesive
ULTRABOND® EPX-3CC is everything you need, and nothing you don’t, because it’s the perfect balance between high performance and high volume. With an installation temperature range of 48 °F to 108 °F, and a full cure in 4...
EPO-TEK® MED-OG198-55
Thixotropic UV Curing Epoxy
ISO 10993 Biocompatible Shadow Cure Capable UV curing epoxy. A translucent cationic/epoxy UV with high viscosity, high Tg, and high strength.
DP 99
Spray Degalvanizer
DP 99 is a degalvanizing spray for use on roll-forming machines, shears, punch press dies and notchers. DP 99 will soften and loosen galvanizing debris while lubricating. Daily use will keep machinery clear of galvanizing build-up. DP 99...
EPO-TEK® HYB-353ND
UV Hybrid
A single component, high temperature hybrid epoxy for semiconductor, and fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking.
CRACKBOND® 2300 GEL
High Strength Gel Bonding Adhesive
CRACKBOND® 2300 GEL (formerly ULTRABOND® 2300) is a two-component, 100% solids, high-strength epoxy bonding adhesive. It is a solvent free, high modulus, moisture insensitive, non-sag epoxy system. CRACKBOND® 2300 GEL is ideal for use in temperatures from 60°F...
EP-PATCH
Higher-performance, low-modulus, epoxy patching mortar
EP-PATCH is a three-component, high-performance, 100% solids, multi-purpose, non-shrink epoxy patching mortar. It is characterized by high early strength, low modulus, excellent workability and excellent bond strength. The system combines a high-quality epoxy resin and curing agent with an engineered blend of graded...
ULTRABOND® EPX-3CC
High Performance Epoxy Anchor Adhesive
ULTRABOND® EPX-3CC is everything you need, and nothing you don’t, because it’s the perfect balance between high performance and high volume. With an installation temperature range of 48 °F to 108 °F, and a full cure in 4...


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