EPO-TEK® MED-OD2002 - Optical Adhesive

Thermally conductive epoxy designed for die attach and heat-sinking applications found in the semiconductor, hybrid microelectronics, and optical industries.

10-2080 is a general purpose, semi rigid polyurethane adhesive for bonding a wide variety of plastic and metal substrates.  Its flexibility allows bonding to substrates with high coefficients of thermal expansion.

ASI 388 Electronic Grade RTV Silicone is a one part, moisture cure sealant that cures to form a tough, durable, flexible rubber that is deal for bonding, sealing, encapsulating and protecting electronic parts.Once cured, ASI 388 will withstand...

Single component, UV curable epoxy adhesive and encapsulant, designed for PCB and circuit assembly applications found in semiconductor, computer, and scientific/OEM industries.

CRACKBOND® JF-90 HD is a two component, moisture insensitive heavy duty epoxy joint filler and crack filling material. Its semi-rigid design allows for use in industrial floors exposed to hard-wheeled forklift traffic. It shaves easily and may be...

Pentra-Clean™ (DC) Daily Cleaner easily removes stains, dirt, grease and grime from concrete, terrazzo, natural stone and tile floor surfaces. This product is easy to use, leaves no film or residue and has a neutral pH with no...