EPO-TEK® OE121 Black Epoxy Underfill

EPO-TEK® OE121 Black Underfill Epoxy Adhesive

Low temperature curing epoxy adhesive designed for semiconductor flip chip underfill. It is color coded black for visual ID during the underfilling process. It may also be used for adhesive, potting, sealing, and encapsulation applications found within the electronics, and optical industries. It is a black version of EPO-TEK® OE121

SDS TDS

Features

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Type

Document Name

File Size

Technical Data Sheet

Document Name EPO-TEK® OE121 Black TDS

File Size 87.8 KB

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Safety Data Sheet

Document Name EPO-TEK® OE121 Black SDS

File Size 534.1 KB

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Brand:

Epoxy Technology

Technology:

Epoxy

Application:

Microelectronics/Semiconductors Optical Sensors and Camera Modules

Market:

Electronics Optical, Datacom and Telecom

Function:

Encapsulation Potting Potting and Encapsulation Underfill

Available Packaging

Please call the technical team at
1-978-667-3805 to discuss packaging options.

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