EPO-TEK® OE121 Black

Oe121 01

Underfill Epoxy

Low temperature curing epoxy adhesive designed for semiconductor flip chip underfill. It is color coded black for visual ID during the underfilling process. It may also be used for adhesive, potting, sealing, and encapsulation applications found within the electronics, and optical industries. It is a black version of EPO-TEK® OE121

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