Certifications
Related Products

2590 / 2595 HOSES
Foam Adhesive Canister Hoses
Hoses for DP 2590 Duct Liner Adhesive and DP 2595 Closed Cell Foam Adhesive canisters. AVAILABLE IN 12 FT. LENGTHS.

XD-CURE
Concrete Curing Compound and Sealer
XD-CURE is a clear, odorless, water-based concrete curing compound that is formulated to ensure proper concretestrength development, help prevent shrinkage cracks, and leave a bondable surface for further coatings, treatments or flooring materials.

DP 3060
Low Viscosity Lagging Adhesive
A low viscosity, premium quality, UL Classified, Low VOC, water based, quick drying, low odor lagging adhesive and protective coating for indoor use. The lower viscosity of DP 3060 makes it an ideal lap adhesive for pipe insulation...

EPO-TEK® OE121
Underfill Epoxy Adhesive
Optically clear, low stress, capillary grade semiconductor underfill. It is clear and colorless and capable of curing at low temperatures in the range of 23ºC to 80ºC, suggested for opto-device flip chip packaging. It can also be used...

60-7111RCL
UV Curable Urethane Adhesive & Encapsulant
Non-yellowing UV urethane adhesive and encapsulant.

EPO-TEK® 930-4
Thermally Conductive Epoxy Adhesive
Two component, thermally conductive epoxy, formulated with a very fine boron-nitride filler particle. Also available in a single component frozen syringe.
2590 / 2595 HOSES
Foam Adhesive Canister Hoses
Hoses for DP 2590 Duct Liner Adhesive and DP 2595 Closed Cell Foam Adhesive canisters. AVAILABLE IN 12 FT. LENGTHS.
XD-CURE
Concrete Curing Compound and Sealer
XD-CURE is a clear, odorless, water-based concrete curing compound that is formulated to ensure proper concretestrength development, help prevent shrinkage cracks, and leave a bondable surface for further coatings, treatments or flooring materials.
DP 3060
Low Viscosity Lagging Adhesive
A low viscosity, premium quality, UL Classified, Low VOC, water based, quick drying, low odor lagging adhesive and protective coating for indoor use. The lower viscosity of DP 3060 makes it an ideal lap adhesive for pipe insulation...
EPO-TEK® OE121
Underfill Epoxy Adhesive
Optically clear, low stress, capillary grade semiconductor underfill. It is clear and colorless and capable of curing at low temperatures in the range of 23ºC to 80ºC, suggested for opto-device flip chip packaging. It can also be used...
60-7111RCL
UV Curable Urethane Adhesive & Encapsulant
Non-yellowing UV urethane adhesive and encapsulant.
EPO-TEK® 930-4
Thermally Conductive Epoxy Adhesive
Two component, thermally conductive epoxy, formulated with a very fine boron-nitride filler particle. Also available in a single component frozen syringe.


Get in touch to learn more
Speak to us on 1-978-667-3805
Contact usEPO-TEK® OE188
High Temperature, Low CTE EpoxyLet's talk
We're here to help you create the perfect product.















