EPO-TEK® OE188 - High Temperature, Low CTE Epoxy

ULTRABOND® ASF-2000 is a domestically manufactured, two-component styrene free, acrylic adhesive used for anchoring and doweling applications in uncracked concrete with threaded rod and rebar. It is suitable for use in temperatures between 5 °F and 110 °F...

Ultra clear epoxy with an RI of 1.523 at 589 nm. High purity grade polymer system with a bubble free and glass smooth finish. Available as lower viscosity version 20-3302NCLV.

A premium grade, UL Listed, Low VOC, smooth, water based, high pressure/high velocity duct sealant for commercial and residential supply and return air duct use. The consistency of DP 1010 allows for better coverage and ease of application....

ASI 335 Window & Door Sealant is a single component, nonslump, moisture curing neutral cure oxime silicone that cures to form a tough, non-corrosive, flexible rubber with outstanding resistance to weather & UV degradation.ASI 335 Window & Door...

Optically clear, low stress, capillary grade semiconductor underfill. It is clear and colorless and capable of curing at low temperatures in the range of 23ºC to 80ºC, suggested for opto-device flip chip packaging. It can also be used...

Toughened, flexible, and impact resistant adhesive with high peel and shear strength. Ideal for bonding metals, plastics, and rubbers. Also available in a translucent unfilled version, 10-3216TR.