EPO-TEK® OG198-763 - UV & UV Hybrid

High glass transition temperature silver epoxy designed for chip bonding in microelectronic and optoelectronic applications. 

Room temperature curing epoxy featuring very low viscosity, clear and excellence optical-mechanical properties.

High Temperature  Resistance & Low outgassing Epoxy Meeting NASA ASTM E595 & Telcordia GR-1221.

CRACKBOND® 2300 GEL (formerly ULTRABOND® 2300) is a two-component, 100% solids, high-strength epoxy bonding adhesive. It is a solvent free, high modulus, moisture insensitive, non-sag epoxy system. CRACKBOND® 2300 GEL is ideal for use in temperatures from 60°F...

ASI 55 Industrial & Construction Hybrid Sealant/Adhesive uses ASI’s innovative hybrid technology to provide a one part, elastomeric sealant/adhesive that will perform in a variety of demanding environments and applications without degrading.Unlike conventional polyurethanes and solvent based sealants/...

NSF/ANSI 61 & 372 CertifiedULTRABOND® HS-1CC is the world’s first anchoring epoxy formulated to be IBC/IRC compliant in both bulk and cartridge delivery systems. For use in dry, damp, water-filled and submerged applications, even in the most extreme...