EPO-TEK® OJ2933-LH - Nonconductive Adhesive

EPO-TEK® H65-175MP is a single component, alumina-filled epoxy for hybrid die and component attach.  It can also be used for semiconductor and high temperature ceramic and vauum packaging.

ASI 502 100% RTV Silicone is a one-component, moisture cure, acetoxy silicone that cures to form an extremely durable rubber that can withstand a variety of extreme environments.Unlike many organic sealants, ASI 502 is extremely resistant to degradation,...

EP75-SEAL is a highly penetrating, two-component epoxy healer/sealer. Its rapid cure time allows traffic to re-open in less than six hours.

ASI 505 Self-Leveling RTV Silicone is a one-component, moisture cure, flowable material designed for a variety of potting, coating, sealing and waterproofing applications.Once applied, ASI 505 will begin skinning in 8 minutes and continue curing to form a...

Aluminum filled epoxy with excellent thermal conductivity that passes ASTM E595 NASA low outgassing.

EP-GEL FAST is a two-component, 100% solids, high-modulus epoxy gel adhesive that offers exceptional strength in doweling and anchoring applications.