EPO-TEK® OJ2933-LH - Nonconductive Adhesive

Long pot life, high temperature epoxy designed for semiconductor, hybrid, fiber, and optical applications.  Fiber optic adhesive designed to meet Telecordia 1221.

A non-curing, non-skinning, solvent based pumpable butyl injection seam sealant ideal for sealing seams in Pittsburgh, Button Punch, Snap Lock and roll formed seams. DP Seam Sealant is ideal for coil line applications.Non-curing and non-skinning.Permanently pliable.

EP-PATCH is a three-component, high-performance, 100% solids, multi-purpose, non-shrink epoxy patching mortar. It is characterized by high early strength, low modulus, excellent workability and excellent bond strength. The system combines a high-quality epoxy resin and curing agent with an engineered blend of graded...

Shadow Curable UV Epoxy. Thixotropic version of EPO-TEK® OG198-54.

ASI 335 Neutral Cure RTV Silicone is a one-part, non-slump, moisture cure sealant/adhesive that cures to form a tough rubber with long-term flexibility and durability.Due to the formulation, ASI 335 offers advanced adhesion to a variety of surfaces...

A premium quality, low viscosity, Low VOC, water based, high strength, quick drying, low odor weather barrier coating. DP 5060 is recommended for indoor and outdoor use where a breather mastic is required. It is used for bonding...