EPO-TEK® P1011-2 - SIlver Chip Bonding Polyimide

Single component, UV curable epoxy adhesive and encapsulant, designed for PCB and circuit assembly applications found in semiconductor, computer, and scientific/OEM industries.

100% solids silver-filled epoxy system for chip bonding in microelectronic and optoelectronics.

Versatile variable mix ratio epoxy with high peel strength and outstanding thermal shock, impact, and vibration resistance. Available in regular, non sag, and high viscosities.

Room temperature curing epoxy featuring very low viscosity, clear and excellence optical-mechanical properties.

A high-performance HVAC, industrial, commercial, and residential construction grade 100% Acetoxy RTV Silicone adhesive/sealant that can withstand extreme heat while maintaining its physical properties. DP 503 has excellent resistance to aging, weathering, and UV degradation and will provide...

Pentra-Finish™ (HG) is an advanced, high-gloss, fast-drying lithium sealer that creates a microfilm on polished concrete, stone, terrazzo, masonry and other cementitious surfaces. This easy-to-use finish increases shine, enhances color and improves resistance against abrasion and stains. Pentra-Finish™...