EPO-TEK® P1011-2 - SIlver Chip Bonding Polyimide

ASI 306 Electronic Grade Self-Leveling Silicone is a one component, RTV (room temperature vulcanizing) product that can be used for encapsulating, coating and sealing.No acetic acid or other corrosive by-products are generated during its cure which allows the...

A clear, premium grade, water based, UL Classified duct liner adhesive specifically formulated for spray, brush, roller and coil line applications. DP 2500 Clear eliminates many of the issues associated with over-spraying colored duct liner adhesive when fabricating...

Single component, electrically insulating, thermally conductive epoxy adhesive designed for heat-sinking of semiconductors, hybrids, electronics, and optics. 

Polymer modified Portland cement blend of specialty aggregates and admixtures. Provides rapid setting, high strength, durable, concrete repairs. 

Thermally conductive and electrical insulating epoxy with a smooth, flowable consistency, designed for chip bonding. Modified version of EPO TEK® H70E, designed primarily for die stamping 

Aluminum filled epoxy with excellent thermal conductivity that passes ASTM E595 NASA low outgassing.