EPO-TEK® T-7 - Thermally Conductive Epoxy

Thermally conductive and electrical insulating epoxy with a smooth, flowable consistency, designed for chip bonding. Modified version of EPO TEK® H70E, designed primarily for die stamping 

XD-CURE is a clear, odorless, water-based concrete curing compound that is formulated to ensure proper concretestrength development, help prevent shrinkage cracks, and leave a bondable surface for further coatings, treatments or flooring materials.

Low viscosity thermal shock epoxy with a Dielectric Strength of 1857 V/mil.

Pentra-Sil® (IH) was designed to give concrete polishers an easy-to-use densifier that greatly improves the final finish of polished concrete by dramatically hardening the substrate and allowing abrasive tooling to work more efficiently and effectively. The Pentra-Sil® (IH)...

A residential use UL Listed, Low VOC, fiber reinforced, water based, high pressure/high velocity duct sealant for residential supply and return air duct use. The consistency of DP 1050 allows for easier sealing of holes and gaps often...

ASI 12SK Butyl Sealant is a one part, butyl-based sealant formulated to perform better than the average butyl by using synthetic fibers for more flexibility, better adhesion and greater versatility.ASI 12SK provides a long-term seal between all types...