EPO-TEK® T-7 - Thermally Conductive Epoxy

Single component, low viscosity, electrically and thermally insulating shadow curable UV epoxy.

Low halogen version of OG142-112, single component, low viscosity, UV curable epoxy for adhesive sealing and encapsulating fiber optic and optoelectronic packaging applications.

ASI 306 Electronic Grade Self-Leveling Silicone is a one component, RTV (room temperature vulcanizing) product that can be used for encapsulating, coating and sealing.No acetic acid or other corrosive by-products are generated during its cure which allows the...

A foil backed butyl mastic rolled sealant tape that is fully cured, high pressure/high velocity rated for use on commercial and residential supply and return air ducts. DP Foil Mastic Tape is pressure sensitive and requires no cure...

Fast curing, flame retardant epoxy adhesive that meets UL 94 V-0 requirements. 2:1 mix ratio available in dual barrel TriggerBond cartridges and in bulk packaging.

ISO 10993 Biocompatible Shadow Cure Capable UV curing epoxy. A translucent cationic/epoxy UV with high viscosity, high Tg, and high strength.