EPO-TEK® T7109-20 - Flexible Thermally Conductive Epoxy

A non-curing, non-skinning, solvent based pumpable butyl injection seam sealant ideal for sealing seams in Pittsburgh, Button Punch, Snap Lock and roll formed seams. DP Seam Sealant is ideal for coil line applications.Non-curing and non-skinning.Permanently pliable.

Water resistant, room temperature cure adhesive that meets FDA regulations Sections 175.105 and 175.300 permitting use in "indirect" food contact applications.

Medium hardness polyurethane with excellent dielectric strength and low toxicity. Also available as faster gelling versions 20-2183 and 20-2184. Softer Shore A Hardness versions available as 20-2101, 20-2140, and 20-2160.

A skinning, permanently flexible butyl joint sealant that is ideal for low and high temperature insulation applications. DP 40 is recommended to seal joints in cellular foam glass and remains flexible to -70° F. DP 40 acts as...

A single component, high temperature hybrid epoxy for semiconductor, and fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking. 

A UL Listed, Low VOC, fiber reinforced, water based, high pressure/high velocity duct sealant for commercial and residential supply and return air duct use. The consistency of DP 1030 allows for easier sealing of holes and gaps often...