EPO-TEK® T7110 Thermally Conductive Insulating Epoxy

Features

Low viscosity allows for bubble-free potting and encapsulation.
Room temperature or low temperature cure (< 100°C) permits use in temperature sensitive devices.
Low exothermic chemistry during polymerization. This allows up to one liter to be cast or potted in volumes.

Applications

Semiconductor: capillary flow underfill for flip chip mounted die; possible glob top “fill” encapsulant.
Electronics: heat sinking; thermally conductive potting and general protection of PCB and SMDs; potting thermistors into cavities; potting and protection of resistor coils or Peltier devices.
Hybrids: potting power modules found in electronics such as cockpit, aerospace and Rf/Microwave devices.
Optical: encapsulation around copper coils found in nuclear and magnetic imaging; heat sinking outdoor LCD / touch panels exposed to sunlight.

Downloads

Type

Document Name

File Size

Technical Data Sheet

Document Name EPO-TEK® T7110 TDS

File Size 627.1 KB

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Safety Data Sheet

Document Name EPO-TEK® T7110 SDS

File Size 429.2 KB

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Safety Data Sheet

Document Name EPO-TEK® T7110 Syringe SDS

File Size 272.0 KB

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Brand:

Epoxy Technology

Technology:

Epoxy

Application:

Consumer Electronics and PCBA E-mobility Microelectronics/Semiconductors

Market:

Aerospace and Defense Automotive and Transportation Electronics Optical, Datacom and Telecom

Function:

Bonding Glop-Top Potting and Encapsulation Thermal Transfer

Available Packaging

Please call the technical team at
1-978-667-3805 to discuss packaging options.

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Get in touch to learn more

Speak to us on 1-978-667-3805

EPO-TEK® T7110 - Thermally Conductive Electrically Insulating Epoxy

Features

Applications

Downloads

Available Packaging

Please call the technical team at
1-978-667-3805 to discuss packaging options.