Features
- Low viscosity allows for bubble-free potting and encapsulation.
- Room temperature or low temperature cure (< 100°C) permits use in temperature sensitive devices.
- Low exothermic chemistry during polymerization. This allows up to one liter to be cast or potted in volumes.
Applications
- Semiconductor: capillary flow underfill for flip chip mounted die; possible glob top “fill” encapsulant.
- Electronics: heat sinking; thermally conductive potting and general protection of PCB and SMDs; potting thermistors into cavities; potting and protection of resistor coils or Peltier devices.
- Hybrids: potting power modules found in electronics such as cockpit, aerospace and Rf/Microwave devices.
- Optical: encapsulation around copper coils found in nuclear and magnetic imaging; heat sinking outdoor LCD / touch panels exposed to sunlight.
Available Packaging
Please call the technical team at
1-978-667-3805 to discuss packaging options.

Related Products

50-3152FR
Thermally Conductive Potting Epoxy
Potting and encapsulating UL 94 V-0 listed epoxy with a CTI > 600 Volts. UL File Number E235584.

20-3060
Impact Resistant Epoxy
Low viscosity epoxy with excellent impact and vibration resistance and improved chemical resistance. May be paired with 3 different catalysts.

20-3305
Thermal Shock Resistance Epoxy
Low viscosity thermal shock epoxy with a Dielectric Strength of 1857 V/mil.

10-3216
Impact Resistant Adhesive
Toughened, flexible, and impact resistant adhesive with high peel and shear strength. Ideal for bonding metals, plastics, and rubbers. Also available in a translucent unfilled version, 10-3216TR.

EPO-TEK® 353ND
Low Outgassing Optical Epoxy
High Temperature Resistance & Low outgassing Epoxy Meeting NASA ASTM E595 & Telcordia GR-1221.

10-3005 Series
High Strength Bonding Epoxy
5-minute set, high bond strength epoxy ideal for on field repairs. Also available in high viscosity (HV) and non-sag (NS) versions. Related products include the 10-3020 series (20 minute set) and the 10-3046 series (46 minute set).
50-3152FR
Thermally Conductive Potting Epoxy
Potting and encapsulating UL 94 V-0 listed epoxy with a CTI > 600 Volts. UL File Number E235584.
20-3060
Impact Resistant Epoxy
Low viscosity epoxy with excellent impact and vibration resistance and improved chemical resistance. May be paired with 3 different catalysts.
20-3305
Thermal Shock Resistance Epoxy
Low viscosity thermal shock epoxy with a Dielectric Strength of 1857 V/mil.
10-3216
Impact Resistant Adhesive
Toughened, flexible, and impact resistant adhesive with high peel and shear strength. Ideal for bonding metals, plastics, and rubbers. Also available in a translucent unfilled version, 10-3216TR.
EPO-TEK® 353ND
Low Outgassing Optical Epoxy
High Temperature Resistance & Low outgassing Epoxy Meeting NASA ASTM E595 & Telcordia GR-1221.
10-3005 Series
High Strength Bonding Epoxy
5-minute set, high bond strength epoxy ideal for on field repairs. Also available in high viscosity (HV) and non-sag (NS) versions. Related products include the 10-3020 series (20 minute set) and the 10-3046 series (46 minute set).


Get in touch to learn more
Speak to us on 1-978-667-3805
Contact us
EPO-TEK® T7110
Thermally Conductive Electrically Insulating EpoxyLet's talk
We're here to help you create the perfect product.