EPO-TEK® UD1355 - Epoxy-Based Thermal Post Cure

A single component, high temperature hybrid epoxy for semiconductor and fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking. It is a lower viscosity version of...

ULTRABOND® 1300-FG is a two-component, fast-setting adhesive system that offers exceptional strength in anchoring and doweling applications. It is perfect for bonding applications that require a quick turn-around. It may be used in temperatures between 40 °F -...

EP50-OVERLAY is a solvent-free, moisture-insensitive, 100% solids, low-modulus, two-component polymer designed primarily for bonding skid-resistant overlays.

Single component, low viscosity, UV curable epoxy for adhesive sealing and encapsulating fiber optic and optoelectronic packaging application. 

EP-CLEARSEAL is a two-component, moisture-insensitive, self priming, impermeable, high-gloss epoxy sealer that exhibits excellent bond strength. EP-CLEARSEAL uses a cycloaliphatic amine curing system for color retention and chemical resistance.

Pentra-Clean™ (CR) cleans floors by cutting through dirt, grime and residue while using reactive Nano-Lithium® to harden, protect and restore gloss and durability. Cleaning with Pentra-Clean™ (CR) increases the floor’s longevity, reducing maintenance and costly repairs. Ideal for...