EPO-TEK® H61 - Thermally Conductive Epoxy

MIRACLE BOND® REPAIR EPOXY is a multi-purpose, rapid cure, bonding, and repair adhesive. Its specially formulated, non-sag property is ideal for bonding most materials and perfect for both overhead and vertical repairs, while still being easily dispensed from...

ASI 57 Hybrid Class 50 Hybrid Sealant and Adhesive is a one-part, low odor, no-sag polyether sealant that uses ASI’s innovative hybrid technology to produce a material that is ideal for a wide range of applications where a...

ULTRABOND® EPX-3CC is everything you need, and nothing you don’t, because it’s the perfect balance between high performance and high volume. With an installation temperature range of 48 °F to 108 °F, and a full cure in 4...

Non-yellowing UV urethane adhesive and encapsulant.

EPX50‑SC (Standard Cure) is a moisture‑insensitive, low‑modulus epoxy urethane co‑polymer engineered to deliver dependable performance in demanding concrete preservation environments. Applied as a 1/4" to 3/8" single‑ or dual‑layer system, it forms a durable, chemical‑resistant, and waterproof protective...

Thermally conductive and electrical insulating epoxy with a smooth, flowable consistency, designed for chip bonding. Modified version of EPO TEK® H70E, designed primarily for die stamping