EPO-TEK® H61 - Thermally Conductive Epoxy

MIRACLE BOND® REPAIR EPOXY is a multi-purpose, rapid cure, bonding, and repair adhesive. Its specially formulated, non-sag property is ideal for bonding most materials and perfect for both overhead and vertical repairs, while still being easily dispensed from...

A premium quality, ZERO VOC, 100% solids, UL Classified, high pressure/high velocity butyl gasket tape for commercial and residential supply and return air duct uses. DP 1040 provides a flexible seal between TDC, TDF and applied flange connections...

Water resistant, room temperature cure adhesive that meets FDA regulations Sections 175.105 and 175.300 permitting use in "indirect" food contact applications.

Premium quality, solvent based, fast drying, non-flammable liquid adhesive, pressure sensitive fiberglass duct liner insulation adhesives. They are supplied in convenient spray canister systems which are both portable and cost effective. DP 2590 CA is available as a...

High Temperature  Resistance & Low outgassing Epoxy Meeting NASA ASTM E595 & Telcordia GR-1221.

Thermally conductive and electrical insulating epoxy with a smooth, flowable consistency, designed for chip bonding. Modified version of EPO TEK® H70E, designed primarily for die stamping