EPO-TEK® H61 - Thermally Conductive Epoxy

Optically clear, low stress, capillary grade semiconductor underfill. It is clear and colorless and capable of curing at low temperatures in the range of 23ºC to 80ºC, suggested for opto-device flip chip packaging. It can also be used...

Spray guns for DP 2590 Duct Liner Adhesive and DP 2595 Closed Cell Foam Adhesive canisters.

UL 94 V-0 listed potting epoxy with excellent electrical insulation properties with 5 different catalyst options. CAT.12, CAT.30, and CAT.190 provide a wide range of mix viscosity options. CAT.150 and CAT.154 available for a low mix viscosity with...

Not only is it remarkably easy to apply, but it can be applied at temperatures as low as 25°F – and no rinsing is required, making it not only simple but also easy on the environment. It can...

EPX50LT-OVERLAY is a moisture-insensitive, low-modulus, epoxy urethane co-polymer overlay resin, designed to be applied in late season cold conditions down to 30 °F and rapid return to service applications.

10-2080 is a general purpose, semi rigid polyurethane adhesive for bonding a wide variety of plastic and metal substrates.  Its flexibility allows bonding to substrates with high coefficients of thermal expansion.