EPO-TEK® H61 - Thermally Conductive Epoxy

MIRACLE BOND® REPAIR EPOXY is a multi-purpose, rapid cure, bonding, and repair adhesive. Its specially formulated, non-sag property is ideal for bonding most materials and perfect for both overhead and vertical repairs, while still being easily dispensed from...

Low stress and low temperature cure temperature version of H35-175MP.

Optically clear, low stress, capillary grade semiconductor underfill. It is clear and colorless and capable of curing at low temperatures in the range of 23ºC to 80ºC, suggested for opto-device flip chip packaging. It can also be used...

EPX50-RC (Rapid Cure) delivers fast, high-strength performance for demanding infrastructure applications. This moisture-insensitive epoxy-urethane overlay meets ASTM C881 / AASHTO M235 Type III and forms a durable, waterproof, anti-skid surface ideal for bridge decks, elevated slabs, and high-friction...

CRACKBOND® 2100 MV (Medium Viscosity, a product formerly known as ULTRABOND® 2100) and 2100 MV-LPL (Medium Viscosity – Long Pot Life) products are two-component, high-strength epoxy adhesives that are ideal for bonding fresh to hardened concrete or perfect...

ASI 12SK Butyl Sealant is a one part, butyl-based sealant formulated to perform better than the average butyl by using synthetic fibers for more flexibility, better adhesion and greater versatility.ASI 12SK provides a long-term seal between all types...