20-3305

Features

Substrates

Downloads

Type

Document Name

File Size

Technical Data Sheet

Document Name 20-3305 TDS

File Size 195.0 KB

View

Safety Data Sheet

Document Name 20-3305RTA Resin SDS

File Size 256.7 KB

View

Safety Data Sheet

Document Name 20-3305CTB Catalyst SDS

File Size 245.6 KB

View

Brand:

Epoxies, Etc.

Technology:

Epoxy

Application:

E-mobility

Market:

Aerospace and Defense Automotive and Transportation Electronics

Related Products

Viewing options:

EPO-TEK® 353ND

Optical Grade Epoxy

High Temperature Resistance & Low outgassing Epoxy Meeting NASA ASTM E595 & Telcordia GR-1221.

SDS TDS

EPO-TEK® T7110

Thermally Conductive Adhesive

Thermally conductive, electrically insulating epoxy designed for heat sinking electronics and semiconductors. It may be used as an adhesive, potting, or encapsulation material, for industries such as consumer or optics.

TDS

20-3060

Potting & Encapsulating

Low viscosity epoxy with excellent impact and vibration resistance and improved chemical resistance. May be paired with 3 different catalysts.

TDS

20-2362FR

Potting & Encapsulating

Flame retardant, UL 94 V-0 listed urethane. Low viscosity and low Tg makes this product ideal for cushioning and protecting sensitive electronics. UL File Number E235584.

TDS

10-3216

Adhesives & Sealants

Toughened, flexible, and impact resistant adhesive with high peel and shear strength. Ideal for bonding metals, plastics, and rubbers. Also available in a translucent unfilled version, 10-3216TR.

TDS

50-3150RFRBK

Thermally Conductive

UL 94 V-0 listed potting epoxy with excellent electrical insulation properties with 5 different catalyst options. CAT.12, CAT.30, and CAT.190 provide a wide range of mix viscosity options. CAT.150 and CAT.154 available for a low mix viscosity with...

TDS

Get in touch to learn more

Speak to us on 401-946-5564

20-3305 - Potting & Encapsulating

Features

Applications

Substrates

Downloads