EPO-TEK® 353ND
Low Outgassing Optical Epoxy
High Temperature Resistance & Low outgassing Epoxy Meeting NASA ASTM E595 & Telcordia GR-1221.
EPO-TEK® H20E
Silver Filled Electrically Conductive Epoxy
100% solids silver-filled epoxy system for chip bonding in microelectronic and optoelectronic.
10-2055 Series
Thixotropic Adhesive for High CTE Substrates
General purpose, semi flexible thixotropic adhesives for high CTEsubstrates available in either a light or heavy paste.
10-2080
Polyurethane Adhesive
10-2080 is a general purpose, semi rigid polyurethane adhesive for bonding a wide variety of plastic and metal substrates. Its flexibility allows bonding to substrates with high coefficients of thermal expansion.
10-3003 Series
High Peel Strength Epoxy
Versatile variable mix ratio epoxy with high peel strength and outstanding thermal shock, impact, and vibration resistance. Available in regular, non sag, and high viscosities.
10-3006
Non-Sag Patch & Repair Epoxy System
10-3006 is a non-sag fast setting patch & repair epoxy system and is dry to the touch in 5-10 minutes.
10-3009NC
Low Viscosity Epoxy Adhesive & Potting Compound
10-3009 NC is a low viscosity epoxy adhesive and potting compound. This product offers a good combination of peel and tensile strength. 10-3009 NC provides electrical insulation and outstanding adhesion.
10-3012
Fast Setting Epoxy Adhesive
10-3012 is a high strength, fast setting epoxy adhesive. This epoxy adhesive and potting compound is specially formulated for high clarity, good impact strength and water resistance
10-3013
Instant Setting Cyanoacrylate Adhesive
10-3013 is a medium viscosity, instant setting Ethyl Cyanoacrylate adhesive. This fast-setting adhesive is formulated for the bonding of plastics, rubbers, paper, metals, and other common substrates.
