20-3063
Epoxy Potting & Encapsulating Compound
20-3063 is an electronic grade potting and encapsulating compound. This epoxy system is designed for applications requiring an easy and affordable potting process.
20-3064
Flexible Epoxy Potting Compound & Adhesive
20-3064 NC is a filled Epoxy Resin System engineered to give the end user the ability to control the hardness of the cured casting. By varying the mix ratio, the hardness can be varied from 60 Shore A...
20-3065
Low Viscosity Potting & Encapsulating Resin
20-3065 NC is a general purpose, low viscosity epoxy potting and encapsulating resin system.
20-3068
Epoxy Adhesive & Potting Compound
20-3068 is a room temperature curing, two component, epoxy potting compound and adhesive. This product provides good water resistance, adhesion, and toughness.
20-3072
Epoxy Adhesive & Potting Compound
20-3072 is a room temperature curing, two component, epoxy potting compound and adhesive. Both the 20-3072 and 20-3072LV (low viscosity version of 20-3072) provide good water resistance, adhesion, and toughness.
20-3074
Epoxy Potting Compound
20-3074NC is a low viscosity epoxy potting compound. This material forms excellent bonds to most substrates, has a convenient 1:1 mix ratio and a low exothermic reaction during cure.
20-3221
Low Viscosity Potting and Encapsulating Resin
20-3221 is a very low viscosity epoxy potting, casting and encapsulating resin system. It is a filled system resulting in excellent dimensional stability and low shrinkage.
20-3237
Flexible Epoxy Potting Compound
20-3237 is a new 1:1 ratio, low viscosity Epoxy Rubber System designed for potting delicate electronic components requiring inspection.
20-3238
Water Clear Optical Grade Epoxy
20-3238 is a two-component high purity grade polymer epoxy system. Its low viscosity is ideal for filling small cavities.
