EPO-TEK® 343ND-LH
Optical Epoxy Adhesive
Low Halogen, Low Temperature Cure and High Tg Optical epoxy. Faster Curing than our GOLD STANDARD EPO-TEK® 353ND
EPO-TEK® 353ND
Low Outgassing Optical Epoxy
High Temperature Resistance & Low outgassing Epoxy Meeting NASA ASTM E595 & Telcordia GR-1221.
EPO-TEK® 353ND-T
Thixotropic Optical Epoxy Adhesive
Highly thixotropic epoxy with non-flowing properties and high temperature resistance.
EPO-TEK® 375-T
Optical Epoxy
Higher viscosity version of EPO-TEK® 375. Designed for use in fiber optic applications.
EPO-TEK® 377H
Graphite Filled Bonding Epoxy
Graphite-filled, High Temperature Epoxy designed for ESD/EMI shielding of semiconductor devices and electronics. It can be used in many electronic industries like consumer, military, and optical/OEM /fiber optics. It is an electrically conductive version of EPO-TEK® 377.
EPO-TEK® 430
Electrically Conductive Epoxy
A two component, copper-filled, electrically and thermally conductive epoxy for adhesive bonding in electronics. It may be used at the PCB level for inter-connecting, grounding and EMI RF shielding. Fast curing at relatively low temperatures may be realized.
EPO-TEK® 730
Thixotropic Epoxy Adhesive
All purpose thixotropic and room temperature-curing epoxy adhesive.
EPO-TEK® 730-110
Thermally and Electrically Insulating Epoxy
Room temperature-curing, thermally and electrically insulating epoxy.
EPO-TEK® 930-4
Thermally Conductive Epoxy Adhesive
Two component, thermally conductive epoxy, formulated with a very fine boron-nitride filler particle. Also available in a single component frozen syringe.
