EPO-TEK® T7110
Thermally Conductive Adhesive
Thermally conductive, electrically insulating epoxy designed for heat sinking electronics and semiconductors. It may be used as an adhesive, potting, or encapsulation material, for industries such as consumer or optics.
EPO-TEK® TZ101
Thermally Conductive Adhesive
Single component, electrically insulating, thermally conductive epoxy adhesive designed for heat-sinking of semiconductors, hybrids, electronics, and optics.
EPX50-OVERLAY
Polymer Resin
Moisture-insensitive, low-modulus epoxy-urethane co-polymer overlay resin.
EPX50-OVERLAY FAST
Setting Formulation
Fast setting, low -modulus, epoxy urethane co-polymer.
MIRACLE BOND® Repair Epoxy
Non-Sag, Easy To Dispense, Multi-Purpose Repair Epoxy
MIRACLE BOND® REPAIR EPOXY is a multi-purpose, rapid cure, bonding, and repair adhesive. Its specially formulated, non-sag property is ideal for bonding most materials and perfect for both overhead and vertical repairs, while still being easily dispensed from...
PILE ANCHOR GROUT
Epoxy Anchoring Grout
Fast-strength, fast-setting epoxy anchoring grout.
