EPO-TEK® OG603
Acrylate-Based UV Cure
This all-purpose general adhesive is a single-component, low viscosity, UV-curable formula that cures in seconds for optical applications, medical uses, and PCB-level electro-optics. It is also suitable for sealing and coating applications.
EPO-TEK® OG653
Acrylate-Based UV Cure
UV curable adhesive designed for glob top encapsulation.
EPO-TEK® OG675
Acrylate-Based UV Cure
A UV fast-curing, flexible adhesive with medium viscosity and optical clarity.
EPO-TEK® OH105-2
Nonconductive Adhesive
Two component optically opaque epoxy. It is a more flexible, thixotropic alternative to EPO-TEK® 320.
EPO-TEK® OJ2933-LH
Nonconductive Adhesive
Low halogen snap curable thixotropic longer pot life version of EPO-TEK® 353ND.
EPO-TEK® OM118
Nonconductive Epoxy Adhesive
Two component, optically clear, electrically and thermally insulating epoxy designed for adhesive, sealing, and encapsulation applications found in semiconductor, medical, filtration, and scientific/OEM industries. It is a slightly higher viscosity and Tg alternative to EPO-TEK® 301.
EPO-TEK® OM125
Optical Epoxy Adhesive
Two component, high Tg optical epoxy designed for bonding multi-mode fiber optic connectors.
EPO-TEK® T-7
Thermally Conductive Epoxy
Two component, thermally conductive, electrically insulating epoxy designed for chip bonding in semiconductor, microelectronic, optoelectronics, and general electronic assembly applications. It can be used at the chip or PCB packaging level interconnect.
