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65 matches
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EPO-TEK® OE184

Nonconductive Adhesive

A two component, high Tg, optically clear epoxy for packaging and assembly of fiber optics cables and components. It is suggested for termination of fibers into ferrules, or fabrication of waveguide devices. It is a faster curing alternative...

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EPO-TEK® OE188

High Temperature, Low CTE Epoxy

Two component, high Tg, low CTE epoxy designed for adhesive and sealing applications within the semiconductor and fiber optic industries.

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EPO-TEK® OE188-3

Low CTE Epoxy

Two component, high Tg, low CTE epoxy designed for adhesive and sealing applications within the semiconductor, hybrid, sensor device, and fiber industries.

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EPO-TEK® OG116-31

EPO-TEK® OG116-31

UV Epoxy Encapsulant

Single component, UV curable epoxy adhesive and encapsulant, designed for PCB and circuit assembly applications found in semiconductor, computer, and scientific/OEM industries.

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EPO-TEK® OG142

UV & UV Hybrid

Single component, UV curable epoxy designed for adhesive, sealing, and encapsulating applications found in semiconductor, electro-optics, fiber optics, medica, and scientific/OEM industries.

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EPO-TEK® OG142-112

UV Cure Optical Epoxy

This single component, low viscosity epoxy is designed for adhesive sealing and encasulating fiber optic and opto-clectronic packaging applications.

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EPO-TEK® OG142-112LH

EPO-TEK® OG142-112LH

UV Curable Epoxy Adhesive

Low halogen version of OG142-112, single component, low viscosity, UV curable epoxy for adhesive sealing and encapsulating fiber optic and optoelectronic packaging applications.

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EPO-TEK® OG142-87

EPO-TEK® OG142-87

Fiber Optic Epoxy Adhesive

Single component, low viscosity, UV curable epoxy for adhesive sealing and encapsulating fiber optic and optoelectronic packaging application. 

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EPO-TEK® OG148

UV & UV Hybrid

Single component, UV curable epoxy designed for adhesive, sealing, and encapsulating applications found in semiconductor, electro-optics, fiber optics, medical, and scientific/OEM industries. It is a clear, high Tg epoxy.

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