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230 matches
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230 matches
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EPO-TEK® 921-FL

Thermally Conductive Epoxy

A two component, high Tg, electrically insulating, thermally conductive epoxy designed for thermal management applications found in semiconductor, hybrid microelectronics, PCB, and optical industries. It can be an adhesive for mounting heat sinks and substrates, a seal for...

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EPO-TEK® 930

Thermally Conductive Epoxy

Two part, thermally conductive, electrically insulating epoxy. It can be used for heat sinking semiconductor devices, hybrid microelectronics, or optics. 

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EPO-TEK® 930-4

EPO-TEK® 930-4

Thermally Conductive Epoxy Adhesive

Two component, thermally conductive epoxy, formulated with a very fine boron-nitride filler particle. Also available in a single component frozen syringe. 

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EPO-TEK® B13181

Thermally Conductive Epoxy

A single component, thermally conductive, low-halogen, B-Stage epoxy paste.

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EPO-TEK® B9021

B-Stage Epoxy

Single component, B-stageable epoxy paste for semiconductor, microelectronics, and optical assemblies. It can be used in hybrid assemblies for lid-sealing and substrate attach. 

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EPO-TEK® B9101-2 Unfilled

Nonconductive Adhesive

Single component, electrically and thermally insulating epoxy designed for adhesive, sealing, and potting of micro-electronics and semiconductor devices. 

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EPO-TEK® B9126-7

Thermally Conductive Epoxy

Single component, thermally and electrically conductive epoxy adhesive designed for semiconductor die attach and circuit assembly applications. It has a low temperature cure and syringe dispensing rheology. It can be used for electrical connections when bonding chips, SMDs,...

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EPO-TEK® B9126-8

Thermally Conductive Epoxy

Single component, thermally and electrically conductive epoxy adhesive designed for semiconductor die attach and circuit assembly applications. It has a long pot life, low temperature cure and syringe dispensing rheology. It can be used for electrical connections when...

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EPO-TEK® B9144

Nonconductive Adhesive

Two component, optically opaque and slightly flexible epoxy designed for low stress adhesive, potting, and sealing applications found in semiconductor, electronics, medical, and fiber optic industries.

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