EPO-TEK® E3001-6
Electrically Conductive, Silver-Filled Epoxy
This is a single component, electrically and thermally conductive,snap cure, die attach epoxy. It was designed for JEDEC level IC plastic packaging of semiconductors, hybrid micro-electronics and photonic device assembly. It is a single component version of EPO-TEK®...
EPO-TEK® EJ2108
Flexible, Silver-filled Adhesive
This is a two component flexible, silver-filled, electrically and thermally conductive low temperature curing adhesive.
EPO-TEK® EJ2189
Electrically Conductive Epoxy
This is an silver-filled epoxy paste designed for low temperature curing from ambient to 80°C, although other heat cures can be used.
EPO-TEK® EJ2189-LV
Electrically Conductive Epoxy
This is an electrically conductive silver-filled epoxy paste designed for low temperature curing from ambient to 80°C.
EPO-TEK® EJ2312
Room Temperature Curing ECA
Two component room temperature curing electrically conductive adhesive.
EPO-TEK® EK1000
Electrically Conductive Silver Filled Adhesive
High thermal conductive silver filled adhesive.
EPO-TEK® EK1000-1
Silver Conductive Epoxy
This is a single component, longer dry time version of EPO-TEK® EK1000 designed for applications requiring longer working time. Offers exeptional thermal management.
EPO-TEK® EK1000-1-D
Silver Conductive Epoxy
A longer dry time and low viscosity version of EPO-TEK® EK1000 designed for applications requiring longer working time and better flowing than provided by EPO-TEK® EK1000. Offers exceptional thermal management.
EPO-TEK® EK1000-1MP
Electrically Conductive, Silver Epoxy
This single component product offers exceptionally high thermal conductivity making it perfect for power and thermal management. It is a longer dry-time version of EPO-TEK® EK1000-MP and is designed for applications requiring long work times including hybrid die...
