20-3004
Chemical Resistant Epoxy System
20-3004LV & HV are two component chemical resistant epoxy systems. They are developed for potting, coating, and adhesive applications requiring superior chemical resistance and exhibit outstanding bonds to a variety of substrates.
20-3006
Flexible Epoxy Potting & Encapsulating Compound
20-3006 is a unique two component, electronic grade, flexible epoxy potting compound. This system was engineered to provide electrical insulation, chemical protection, and thermal shock resistance.
20-3030
Epoxy Potting & Casting Resin
20-3030 is an unfilled, low viscosity epoxy system. This system was designed for fast, self-leveling and ease of use. 20-3030 has a convenient 2:1 mix ratio and will cure at room temperature
20-3035
Low Density Epoxy Potting Compound
20-3035 is a low density, two component epoxy potting and encapsulating system. The 20-3035 is less than half the weight of most commercially available potting compounds
20-3036
Low Density Epoxy Syntactic Foam
20 3036 is a lightweight epoxy for potting, casting, and encapsulating electronic components and assemblies. It is formulated in a convenient 2:1 by weight mix ratio
20-3037
Low Density Epoxy Adhesive & Sealant
20-3037 is a low density, two component epoxy bonding and sealing system. The 20-3037 is less than half the weight of most commercially available potting compounds.
20-3038
Low Density Syntactic Foam Epoxy
20-3038 is a lightweight epoxy for potting, casting, and encapsulating electronic componentsand assemblies.
20-3060
Impact Resistant Epoxy
Low viscosity epoxy with excellent impact and vibration resistance and improved chemical resistance. May be paired with 3 different catalysts.
20-3063
Epoxy Potting & Encapsulating Compound
20-3063 is an electronic grade potting and encapsulating compound. This epoxy system is designed for applications requiring an easy and affordable potting process.
