EPO-TEK® H20E-MP
Electrically Conductive Silver Epoxy
Low outgassing silver epoxy meeting MIL-STD 883 /5011 and NASA ASTM E595.
EPO-TEK® H20E-PFC
Electrically Conductive, Silver Epoxy
Temiconductor grade epoxy, designed for flip chip interconnects using a solder-free joining method.
EPO-TEK® H20E-PFC-D
Silver Conductive Epoxy
A single component, semiconductor-grade epoxy designed for improved dispensing.
EPO-TEK® H20S
Silver Conductive Epoxy
100% solids silver-filled epoxy system for chip bonding in microelectronic and optoelectronics.
EPO-TEK® H21D
High Tg Silver Epoxy
High glass transition temperature silver epoxy designed for chip bonding in microelectronic and optoelectronic applications.
EPO-TEK® H22
Electrical Conductive, Silver Epoxy
This silver-filled system is engineered specifically for die bonding and sealing hybrid circuit packages.
EPO-TEK® H35-175MP
Low Outgassing Silver Epoxy
Low outgassing silver Epoxy meeting MIL-STD 883 /5011 and NASA ASTM E585.
EPO-TEK® H35-175MPLV
Silver Conductive Epoxy
A single-component, silver-filled epoxy engineered for hybrid die and component attachment, featuring a lower viscosity formulation compared to EPO-TEK® H35-175MP.
EPO-TEK® H35-175MPT
Silver Conductive Epoxy
A single component, silver-filled epoxy for hybrid die and component attach. This product is a higher thixotropic version of EPO-TEK® H35-175MP.
