50-2369FR
Thermally Conductive
Flame retardant, UL 94 V-0 listed fungus resistant potting urethane. UL File Number E235584.
50-3152FR
Thermally Conductive
Potting and encapsulating UL 94 V-0 listed epoxy with a CTI > 600 Volts. UL File Number E235584.
50-3170
Thermally Conductive
Repairable epoxy rubber for low stress encapsulation. Also available as the premixed and frozen F50-3170BK.
EPO-TEK® EK1000
Electrically & Thermally Conductive Epoxy
High thermal conductive silver filled adhesive.
EPO-TEK® H20E
Electrically & Thermally Conductive Epoxy
100% solids silver-filled epoxy system for chip bonding in microelectronic and optoelectronic.
EPO-TEK® H70E
Thermally Conductive Adhesive
Two component, thermally conductive, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronics applications.
EPO-TEK® OG116-31
UV Curable Epoxy
Single component, UV curable epoxy adhesive and encapsulant, designed for PCB and circuit assembly applications found in semiconductor, computer, and scientific/OEM industries.