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50-2369FR

50-2369FR

Thermally Conductive

Flame retardant, UL 94 V-0 listed fungus resistant potting urethane. UL File Number E235584.

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50-3152FR

50-3152FR

Thermally Conductive

Potting and encapsulating UL 94 V-0 listed epoxy with a CTI > 600 Volts. UL File Number E235584.

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50-3170

50-3170

Thermally Conductive

Repairable epoxy rubber for low stress encapsulation. Also available as the premixed and frozen F50-3170BK.

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EPO-TEK® EK1000

EPO-TEK® EK1000

Electrically & Thermally Conductive Epoxy

High thermal conductive silver filled adhesive.

TDS
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EPO-TEK® H20E

EPO-TEK® H20E

Electrically & Thermally Conductive Epoxy

100% solids silver-filled epoxy system for chip bonding in microelectronic and optoelectronic.

TDS
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EPO-TEK® H70E

EPO-TEK® H70E

Thermally Conductive Adhesive

Two component, thermally conductive, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronics applications.

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EPO-TEK® OG116-31

EPO-TEK® OG116-31

UV Curable Epoxy

Single component, UV curable epoxy adhesive and encapsulant, designed for PCB and circuit assembly applications found in semiconductor, computer, and scientific/OEM industries.

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