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20 matches
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ASI 388

ASI 388

Electronic Grade RTV Silicone

ASI 388 Electronic Grade RTV Silicone is a one part, moisture cure sealant that cures to form a tough, durable, flexible rubber that is deal for bonding, sealing, encapsulating and protecting electronic parts.Once cured, ASI 388 will withstand...

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ASI 505

ASI 505

Industrial Grade Silicone Self Leveling

ASI 505 Self-Leveling RTV Silicone is a one-component, moisture cure, flowable material designed for a variety of potting, coating, sealing and waterproofing applications.Once applied, ASI 505 will begin skinning in 8 minutes and continue curing to form a...

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ASI 600

ASI 600

Extreme Temperatures Heat Resistant Silicone

ASI 600 Hi-Temp Resistant RTV Silicone is a one-component, moisture cure, 100% RTV silicone that cures to form an extremely durable rubber that can withstand extreme heat while maintaining its physical properties.Due to the formulation, ASI 600 can...

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EPO-TEK® 301

EPO-TEK® 301

Low Viscosity Optical Grade Epoxy

Room temperature curing epoxy featuring very low viscosity, clear and excellence optical-mechanical properties.

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EPO-TEK® 320

EPO-TEK® 320

Thixotropic Optical Epoxy Adhesive

Black-colored and optically opaque epoxy designed for optical and optoelectronic packaging of semiconductor devices and components. It is a widely used fiber-optic grade epoxy. 

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EPO-TEK® 343ND-LH

EPO-TEK® 343ND-LH

Optical Epoxy Adhesive

Low Halogen, Low Temperature Cure and High Tg Optical epoxy. Faster Curing than our GOLD STANDARD EPO-TEK® 353ND

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EPO-TEK® 730-110

EPO-TEK® 730-110

Thermally and Electrically Insulating Epoxy

Room temperature-curing, thermally and electrically insulating epoxy.

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EPO-TEK® H70E

EPO-TEK® H70E

Electrically Insulating Epoxy

Two component, thermally conductive, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronics applications.

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EPO-TEK® H70S

EPO-TEK® H70S

Thermally Conductive Epoxy

Thermally conductive and electrical insulating epoxy with a smooth, flowable consistency, designed for chip bonding. Modified version of EPO TEK® H70E, designed primarily for die stamping 

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