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ASI 306

ASI 306

Electronic Grade Self-Leveling Silicone

ASI 306 Electronic Grade Self-Leveling Silicone is a one component, RTV (room temperature vulcanizing) product that can be used for encapsulating, coating and sealing.No acetic acid or other corrosive by-products are generated during its cure which allows the...

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ASI 505

ASI 505

Industrial Grade Self-Leveling Silicone

ASI 505 Self-Leveling RTV Silicone is a one-component, moisture cure, flowable material designed for a variety of potting, coating, sealing and waterproofing applications.Once applied, ASI 505 will begin skinning in 8 minutes and continue curing to form a...

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ASI COMPOUND 70

ASI COMPOUND 70

Multi-Purpose Silicone Grease

ASI Compound 70 Multi-Purpose Silicone Grease is a moisture resistant, non-curing paste which retains its consistency and properties over a temperature range of -70°F to 400°F.This stiff, tacky compound is non-melting and retains its properties over extended periods...

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EPO-TEK® 301

EPO-TEK® 301

Optical Grade Epoxy

Room temperature curing epoxy featuring very low viscosity, clear and excellence optical-mechanical properties.

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EPO-TEK® 320

EPO-TEK® 320

Optical Grade Epoxy

Black-colored and optically opaque epoxy designed for optical and optoelectronic packaging of semiconductor devices and components. It is a widely used fiber-optic grade epoxy. 

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EPO-TEK® MED-353ND

EPO-TEK® MED-353ND

Medical Grade Epoxy

ISO 10993 Medical grade high temperature high reliability epoxy. It has decades of use and reliability in medical device designs worldwide. 

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EPO-TEK® OE121

EPO-TEK® OE121

Underfill Epoxy

Optically clear, low stress, capillary grade semiconductor underfill. It is clear and colorless and capable of curing at low temperatures in the range of 23ºC to 80ºC, suggested for opto-device flip chip packaging. It can also be used...

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EPO-TEK® OE121 Black

EPO-TEK® OE121 Black

Underfill Epoxy

Low temperature curing epoxy adhesive designed for semiconductor flip chip underfill. It is color coded black for visual ID during the underfilling process. It may also be used for adhesive, potting, sealing, and encapsulation applications found within the...

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