EPO-TEK® 353ND
Low Outgassing Optical Epoxy
High Temperature Resistance & Low outgassing Epoxy Meeting NASA ASTM E595 & Telcordia GR-1221.
EPO-TEK® H20E
Silver Filled Electrically Conductive Epoxy
100% solids silver-filled epoxy system for chip bonding in microelectronic and optoelectronic.
10-2055 Series
Thixotropic Adhesive for High CTE Substrates
General purpose, semi flexible thixotropic adhesives for high CTEsubstrates available in either a light or heavy paste.
10-2080
Polyurethane Adhesive
10-2080 is a general purpose, semi rigid polyurethane adhesive for bonding a wide variety of plastic and metal substrates. Its flexibility allows bonding to substrates with high coefficients of thermal expansion.
10-3001
High Strength Epoxy Adhesive
10-3001 is a high bond strength epoxy adhesive that yields high peel strength, excellent tensile strength, along with outstanding thermal shock, impact and vibration resistance. This high-performance epoxide adhesive also exhibits outstanding physical, thermal, and electrical insulation properties.
10-3002
Adjustable Flexibility Epoxy Adhesive
10-3002 is a high bond strength epoxy adhesive that has a non-critical mix ratio and adjustable flexibility. It yields high peel strength and excellent tensile strength. has outstanding thermal shock, impact and vibration resistance.
10-3003 Series
High Peel Strength Epoxy
Versatile variable mix ratio epoxy with high peel strength and outstanding thermal shock, impact, and vibration resistance. Available in regular, non sag, and high viscosities.
10-3004NC
Low Viscosity, Adjustable Flexibility Epoxy Adhesive
10-3004NC is a high bond strength epoxy adhesive, with a non-critical mix ratio and adjustable flexibility. 10-3004NC yields high peel strength and excellent tensile strength. It also has outstanding thermal shock, impact and vibration resistance. This high-performance epoxy...
10-3006
Non-Sag Patch & Repair Epoxy System
10-3006 is a non-sag fast setting patch & repair epoxy system and is dry to the touch in 5-10 minutes.
