EPO-TEK® 301-2

Features

Long pot-life (over 8 hours)
Can resist yellowing over 17 days of continuous UV light exposure
Compliant adhesive that will be resistant to impact or vibrations

Applications

Semiconductor applications: underfill for flip chips, glob top encapsulation over wire bonds, spin coating at wafer level including wafer level packaging
Fiber optic adhesive: bundling fibers, terminating fiber into ferrule, adhesive for mounting optics inside fiber components, bonding glass cover slip over V-groove; spectral transmission of visible and IR light

Downloads

Type

Document Name

File Size

Technical Data Sheet

Document Name EPO-TEK® 301-2 TDS

File Size 558.2 KB

View

Safety Data Sheet

Document Name EPO-TEK® 301-2 SDS

File Size 478.1 KB

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Safety Data Sheet

Document Name EPO-TEK® 301-2 Syringe SDS

File Size 285.9 KB

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Certifications

Brand:

Epoxy Technology

Technology:

Epoxy

Application:

Datacom and Telecom E-mobility Microelectronics/Semiconductors Optical Sensors and Camera Modules

Market:

Automotive and Transportation Electronics Optical, Datacom and Telecom

Function:

Bonding Glop-Top Sealing Underfill

Available Packaging

Please call the technical team at
1-978-667-3805 to discuss packaging options.

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