Features
- Long pot-life (over 8 hours)
- Can resist yellowing over 17 days of continuous UV light exposure
- Compliant adhesive that will be resistant to impact or vibrations
Applications
- Semiconductor applications: underfill for flip chips, glob top encapsulation over wire bonds, spin coating at wafer level including wafer level packaging
- Fiber optic adhesive: bundling fibers, terminating fiber into ferrule, adhesive for mounting optics inside fiber components, bonding glass cover slip over V-groove; spectral transmission of visible and IR light
Certifications
- NASA ASTM E595
Available Packaging
Please call the technical team at
1-978-667-3805 to discuss packaging options.

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