Features
- Black-colored and optically opaque, low viscosity epoxy
- Can be used for room temperature curing, low temperature, or box oven elevated temperature cure
- Optically opaque between IR and visible regions of light, including 185 - 2500 nm range
Applications
- Optical: Blocking light in photonics packaging through VIS and NIR range; sensor packaging including IR detectors packaged in TO-cans; bonding of various optics including lens, prism, diodes; adhesion to metals, most plastics and glasses
- Fiber optics: sealing / potting fibers into the boot, ferrule, or fiber feed-through of the package wall
Available Packaging
Please call the technical team at
1-978-667-3805 to discuss packaging options.

Related Products

50-2369FR
Flame Retardant Potting Urethane
Flame retardant, UL 94 V-0 listed fungus resistant potting urethane. UL File Number E235584.

EPO-TEK® OE121 Black
Underfill Epoxy Adhesive
Low temperature curing epoxy adhesive designed for semiconductor flip chip underfill. It is color coded black for visual ID during the underfilling process. It may also be used for adhesive, potting, sealing, and encapsulation applications found within the...

20-3060
Impact Resistant Epoxy
Low viscosity epoxy with excellent impact and vibration resistance and improved chemical resistance. May be paired with 3 different catalysts.

EPO-TEK® 353NDP
PROPEL FORWARD WITH EPO-TEK® 353NDP
Meet the next generation of high-performance solutions. EPO-TEK® 353NDP takes reliability, durability, and efficiency to unprecedented levels—crafted for the challenges of the AI and Machine Learning era, and critical industries like Datacom & Telecom, Defense, Aerospace, and Automotive. ...

EPO-TEK® H37-MP
Low Temperature Cure Epoxy
Low stress and low temperature cure temperature version of H35-175MP.

EPO-TEK® 343ND-LH
Optical Epoxy Adhesive
Low Halogen, Low Temperature Cure and High Tg Optical epoxy. Faster Curing than our GOLD STANDARD EPO-TEK® 353ND
50-2369FR
Flame Retardant Potting Urethane
Flame retardant, UL 94 V-0 listed fungus resistant potting urethane. UL File Number E235584.
EPO-TEK® OE121 Black
Underfill Epoxy Adhesive
Low temperature curing epoxy adhesive designed for semiconductor flip chip underfill. It is color coded black for visual ID during the underfilling process. It may also be used for adhesive, potting, sealing, and encapsulation applications found within the...
20-3060
Impact Resistant Epoxy
Low viscosity epoxy with excellent impact and vibration resistance and improved chemical resistance. May be paired with 3 different catalysts.
EPO-TEK® 353NDP
PROPEL FORWARD WITH EPO-TEK® 353NDP
Meet the next generation of high-performance solutions. EPO-TEK® 353NDP takes reliability, durability, and efficiency to unprecedented levels—crafted for the challenges of the AI and Machine Learning era, and critical industries like Datacom & Telecom, Defense, Aerospace, and Automotive. ...
EPO-TEK® H37-MP
Low Temperature Cure Epoxy
Low stress and low temperature cure temperature version of H35-175MP.
EPO-TEK® 343ND-LH
Optical Epoxy Adhesive
Low Halogen, Low Temperature Cure and High Tg Optical epoxy. Faster Curing than our GOLD STANDARD EPO-TEK® 353ND


Get in touch to learn more
Speak to us on 1-978-667-3805
Contact us
EPO-TEK® 320
Thixotropic Optical Epoxy AdhesiveLet's talk
We're here to help you create the perfect product.

















