Features
- High temperature epoxy
- 24 hour pot life to promote mass production usage
- Designed to meet Telcordia 1221
- Resisting >200°C field conditions.
- Tansmitting light in the optical pathway from 800-1,550 nm range
Applications
- Semiconductor: Wafer to wafer bonding of CSP; fabrication of MEMs devices; flip chip underfill.
- Providing near hermetic seals and UHV seals in sensor devices, resisting high temperature packaging.
- Down-Hole petrochemical fiber optic sensors
- Sealing fiber into ferrules
- Fiber component packaging; adhesive for active alignment of optics, environmental seal of opto-package, V-groove arrays.
- Used as dielectric layer in the fabrication of capacitors; laminating PZT piezoelectric.
- Impregnating and insulating copper coil windings in motors and inductor coils. Bonding ferrite cores and magnets.
Certifications
- Telcordia GR-1221
Available Packaging
Please call the technical team at
1-978-667-3805 to discuss packaging options.
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Optical Grade EpoxyLet's talk
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