EPO-TEK® 323LP

Features

High temperature epoxy
24 hour pot life to promote mass production usage
Designed to meet Telcordia 1221
Resisting >200°C field conditions.
Tansmitting light in the optical pathway from 800-1,550 nm range

Applications

Semiconductor: Wafer to wafer bonding of CSP; fabrication of MEMs devices; flip chip underfill.
Providing near hermetic seals and UHV seals in sensor devices, resisting high temperature packaging.
Down-Hole petrochemical fiber optic sensors
Sealing fiber into ferrules
Fiber component packaging; adhesive for active alignment of optics, environmental seal of opto-package, V-groove arrays.
Used as dielectric layer in the fabrication of capacitors; laminating PZT piezoelectric.
Impregnating and insulating copper coil windings in motors and inductor coils. Bonding ferrite cores and magnets.

Downloads

Type

Document Name

File Size

Technical Data Sheet

Document Name EPO-TEK® 323LP TDS

File Size 557.4 KB

View

Safety Data Sheet

Document Name EPO-TEK® 323LP SDS

File Size 345.9 KB

View

Safety Data Sheet

Document Name EPO-TEK® 323LP Syringe SDS

File Size 740.4 KB

View

Certifications

Brand:

Epoxy Technology

Technology:

Epoxy

Application:

Datacom and Telecom Microelectronics/Semiconductors Off-shore Drilling Optical Sensors and Camera Modules

Market:

Electronics Oil and Renewable Energy Optical, Datacom and Telecom

Function:

Bonding Impregnating Sealing Underfill

Available Packaging

Please call the technical team at
1-978-667-3805 to discuss packaging options.

Related Products

Viewing options:

EPO-TEK® OG142-112LH

UV Curable Epoxy Adhesive

Low halogen version of OG142-112, single component, low viscosity, UV curable epoxy for adhesive sealing and encapsulating fiber optic and optoelectronic packaging applications.

SDS TDS

EPO-TEK® EK1000

Electrically Conductive Silver Filled Adhesive

High thermal conductive silver filled adhesive.

SDS TDS

60-7185RCL

UV Curable Urethane Acrylate

Low viscosity, clear UV aliphatic urethane acrylate for bonding, coating, or encapsulating.

SDS TDS

EPO-TEK® OE121 Black

Underfill Epoxy Adhesive

Low temperature curing epoxy adhesive designed for semiconductor flip chip underfill. It is color coded black for visual ID during the underfilling process. It may also be used for adhesive, potting, sealing, and encapsulation applications found within the...

SDS TDS

EPO-TEK® 353NDP

PROPEL FORWARD WITH EPO-TEK® 353NDP

Meet the next generation of high-performance solutions. EPO-TEK® 353NDP takes reliability, durability, and efficiency to unprecedented levels—crafted for the challenges of the AI and Machine Learning era, and critical industries like Datacom & Telecom, Defense, Aerospace, and Automotive. ...

SDS TDS

EPO-TEK® H70S

Thermally Conductive Epoxy

Thermally conductive and electrical insulating epoxy with a smooth, flowable consistency, designed for chip bonding. Modified version of EPO TEK® H70E, designed primarily for die stamping

SDS TDS