EPO-TEK® 323LP

Features

High temperature epoxy
24 hour pot life to promote mass production usage
Designed to meet Telcordia 1221
Resisting >200°C field conditions.
Tansmitting light in the optical pathway from 800-1,550 nm range

Applications

Semiconductor: Wafer to wafer bonding of CSP; fabrication of MEMs devices; flip chip underfill.
Providing near hermetic seals and UHV seals in sensor devices, resisting high temperature packaging.
Down-Hole petrochemical fiber optic sensors
Sealing fiber into ferrules
Fiber component packaging; adhesive for active alignment of optics, environmental seal of opto-package, V-groove arrays.
Used as dielectric layer in the fabrication of capacitors; laminating PZT piezoelectric.
Impregnating and insulating copper coil windings in motors and inductor coils. Bonding ferrite cores and magnets.

Downloads

Type

Document Name

File Size

Technical Data Sheet

Document Name EPO-TEK® 323LP TDS

File Size 557.4 KB

View

Safety Data Sheet

Document Name EPO-TEK® 323LP SDS

File Size 345.9 KB

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Safety Data Sheet

Document Name EPO-TEK® 323LP Syringe SDS

File Size 740.4 KB

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Safety Data Sheet

Document Name EPO-TEK® 323LP SDS 2026 GHS UPDATE

File Size 532.6 KB

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Certifications

Brand:

Epoxy Technology

Technology:

Epoxy

Application:

Datacom and Telecom Microelectronics/Semiconductors Off-shore Drilling Optical Sensors and Camera Modules

Market:

Electronics Oil and Renewable Energy Optical, Datacom and Telecom

Function:

Bonding Impregnating Sealing Underfill

Available Packaging

Please call the technical team at
1-978-667-3805 to discuss packaging options.

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