Features
- High temperature epoxy
- 24 hour pot life to promote mass production usage
- Designed to meet Telcordia 1221
- Resisting >200°C field conditions.
- Tansmitting light in the optical pathway from 800-1,550 nm range
Applications
- Semiconductor: Wafer to wafer bonding of CSP; fabrication of MEMs devices; flip chip underfill.
- Providing near hermetic seals and UHV seals in sensor devices, resisting high temperature packaging.
- Down-Hole petrochemical fiber optic sensors
- Sealing fiber into ferrules
- Fiber component packaging; adhesive for active alignment of optics, environmental seal of opto-package, V-groove arrays.
- Used as dielectric layer in the fabrication of capacitors; laminating PZT piezoelectric.
- Impregnating and insulating copper coil windings in motors and inductor coils. Bonding ferrite cores and magnets.
Certifications
- Telcordia GR-1221
Available Packaging
Please call the technical team at
1-978-667-3805 to discuss packaging options.

Related Products

EPO-TEK® OG142-112LH
UV Curable Epoxy Adhesive
Low halogen version of OG142-112, single component, low viscosity, UV curable epoxy for adhesive sealing and encapsulating fiber optic and optoelectronic packaging applications.

EPO-TEK® 353ND-T
Thixotropic Optical Epoxy Adhesive
Highly thixotropic epoxy with non-flowing properties and high temperature resistance.

EPO-TEK® 930-4
Thermally Conductive Epoxy Adhesive
Two component, thermally conductive epoxy, formulated with a very fine boron-nitride filler particle. Also available in a single component frozen syringe.

EPO-TEK® 730-110
Thermally and Electrically Insulating Epoxy
Room temperature-curing, thermally and electrically insulating epoxy.

EPO-TEK® 343ND-LH
Optical Epoxy Adhesive
Low Halogen, Low Temperature Cure and High Tg Optical epoxy. Faster Curing than our GOLD STANDARD EPO-TEK® 353ND

EPO-TEK® 301
Low Viscosity Optical Grade Epoxy
Room temperature curing epoxy featuring very low viscosity, clear and excellence optical-mechanical properties.
EPO-TEK® OG142-112LH
UV Curable Epoxy Adhesive
Low halogen version of OG142-112, single component, low viscosity, UV curable epoxy for adhesive sealing and encapsulating fiber optic and optoelectronic packaging applications.
EPO-TEK® 353ND-T
Thixotropic Optical Epoxy Adhesive
Highly thixotropic epoxy with non-flowing properties and high temperature resistance.
EPO-TEK® 930-4
Thermally Conductive Epoxy Adhesive
Two component, thermally conductive epoxy, formulated with a very fine boron-nitride filler particle. Also available in a single component frozen syringe.
EPO-TEK® 730-110
Thermally and Electrically Insulating Epoxy
Room temperature-curing, thermally and electrically insulating epoxy.
EPO-TEK® 343ND-LH
Optical Epoxy Adhesive
Low Halogen, Low Temperature Cure and High Tg Optical epoxy. Faster Curing than our GOLD STANDARD EPO-TEK® 353ND
EPO-TEK® 301
Low Viscosity Optical Grade Epoxy
Room temperature curing epoxy featuring very low viscosity, clear and excellence optical-mechanical properties.


Get in touch to learn more
Speak to us on 1-978-667-3805
Contact us
EPO-TEK® 323LP
High Temperature Optical EpoxyLet's talk
We're here to help you create the perfect product.

















