EPO-TEK® 323LP

Features

High temperature epoxy
24 hour pot life to promote mass production usage
Designed to meet Telcordia 1221
Resisting >200°C field conditions.
Tansmitting light in the optical pathway from 800-1,550 nm range

Applications

Semiconductor: Wafer to wafer bonding of CSP; fabrication of MEMs devices; flip chip underfill.
Providing near hermetic seals and UHV seals in sensor devices, resisting high temperature packaging.
Down-Hole petrochemical fiber optic sensors
Sealing fiber into ferrules
Fiber component packaging; adhesive for active alignment of optics, environmental seal of opto-package, V-groove arrays.
Used as dielectric layer in the fabrication of capacitors; laminating PZT piezoelectric.
Impregnating and insulating copper coil windings in motors and inductor coils. Bonding ferrite cores and magnets.

Downloads

Type

Document Name

File Size

Technical Data Sheet

Document Name EPO-TEK® 323LP TDS

File Size 557.4 KB

View

Safety Data Sheet

Document Name EPO-TEK® 323LP SDS

File Size 345.9 KB

View

Safety Data Sheet

Document Name EPO-TEK® 323LP Syringe SDS

File Size 740.4 KB

View

Certifications

Brand:

Epoxy Technology

Technology:

Epoxy

Application:

Datacom and Telecom Microelectronics/Semiconductors Off-shore Drilling Optical Sensors and Camera Modules

Market:

Electronics Oil and Renewable Energy Optical, Datacom and Telecom

Function:

Bonding Impregnating Sealing Underfill

Available Packaging

Please call the technical team at
1-978-667-3805 to discuss packaging options.

Related Products

Viewing options:

EPO-TEK® H20E

Electrically & Thermally Conductive Epoxy

100% solids silver-filled epoxy system for chip bonding in microelectronic and optoelectronic.

TDS

EPO-TEK® 930-4

Thermally Conductive Adhesive

Two component, thermally conductive epoxy, formulated with a very fine boron-nitride filler particle. Also available in a single component frozen syringe.

TDS

EPO-TEK® H20E-HC

Electrically & Thermally Conductive Epoxy

High thermal conductivity version of EPO-TEK® H20E.

TDS

60-7107RTR

UV Curable

Electronic grade epoxy UV adhesive, coating, and encapsulant with a CTE of 35 ppm/C.

SDS TDS

EPO-TEK® OE121 Black

Underfill Epoxy

Low temperature curing epoxy adhesive designed for semiconductor flip chip underfill. It is color coded black for visual ID during the underfilling process. It may also be used for adhesive, potting, sealing, and encapsulation applications found within the...

SDS TDS

EPO-TEK® T7110

Thermally Conductive Adhesive

Thermally conductive, electrically insulating epoxy designed for heat sinking electronics and semiconductors. It may be used as an adhesive, potting, or encapsulation material, for industries such as consumer or optics.

TDS