Features
- Low Halogen & Green chemistry
- Maintains a long workable viscosity at room temperature and can be cured at 80°C in as little as 30 minutes.
- High Tg is designed to provide high strength at elevated temperatures
Applications
- Fiber Optics: Fiber Ferrule
- Optoelectronics: Optical components sub-assembly
- Piezo Electric Bonding
- LiDARs/IR Sensors
- Motors and Inductor Coils: Insulating copper coil windings
Available Packaging
Please call the technical team at
1-978-667-3805 to discuss packaging options.

Related Products

EPO-TEK® H20E
Electrically & Thermally Conductive Epoxy
100% solids silver-filled epoxy system for chip bonding in microelectronic and optoelectronic.

EPO-TEK® HYB-353ND
UV Hybrid
A single component, high temperature hybrid epoxy for semiconductor, and fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking.

EPO-TEK® T7110
Thermally Conductive Adhesive
Thermally conductive, electrically insulating epoxy designed for heat sinking electronics and semiconductors. It may be used as an adhesive, potting, or encapsulation material, for industries such as consumer or optics.

20-3305
Potting & Encapsulating
Low viscosity thermal shock epoxy with a Dielectric Strength of 1857 V/mil.

EPO-TEK® OG198-55
UV Curable Epoxy
Shadow Curable UV Epoxy. Thixotropic version of EPO-TEK® OG198-54.

60-7107RTR
UV Curable
Electronic grade epoxy UV adhesive, coating, and encapsulant with a CTE of 35 ppm/C.
EPO-TEK® H20E
Electrically & Thermally Conductive Epoxy
100% solids silver-filled epoxy system for chip bonding in microelectronic and optoelectronic.
EPO-TEK® HYB-353ND
UV Hybrid
A single component, high temperature hybrid epoxy for semiconductor, and fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking.
EPO-TEK® T7110
Thermally Conductive Adhesive
Thermally conductive, electrically insulating epoxy designed for heat sinking electronics and semiconductors. It may be used as an adhesive, potting, or encapsulation material, for industries such as consumer or optics.
20-3305
Potting & Encapsulating
Low viscosity thermal shock epoxy with a Dielectric Strength of 1857 V/mil.
EPO-TEK® OG198-55
UV Curable Epoxy
Shadow Curable UV Epoxy. Thixotropic version of EPO-TEK® OG198-54.


Get in touch to learn more
Speak to us on 1-978-667-3805
Contact us
EPO-TEK® 343ND-LH
Optical Grade EpoxyLet's talk
We're here to help you create the perfect product.