EPO-TEK® 343ND-LH

Features

Low Halogen & Green chemistry
Maintains a long workable viscosity at room temperature and can be cured at 80°C in as little as 30 minutes.
High Tg is designed to provide high strength at elevated temperatures

Applications

Fiber Optics: Fiber Ferrule
Optoelectronics: Optical components sub-assembly
Piezo Electric Bonding
LiDARs/IR Sensors
Motors and Inductor Coils: Insulating copper coil windings

Downloads

Type

Document Name

File Size

Technical Data Sheet

Document Name EPO-TEK® 343ND-LH TDS

File Size 535.1 KB

View

Safety Data Sheet

Document Name EPO-TEK® 343ND-LH SDS

File Size 462.6 KB

View

Safety Data Sheet

Document Name EPO-TEK® 343ND-LH Syringe SDS

File Size 909.9 KB

View

Brand:

Epoxy Technology

Technology:

Epoxy

Application:

Datacom and Telecom E-mobility Microelectronics/Semiconductors Optical Sensors and Camera Modules Radar Systems, Navigation and Sensors

Market:

Automotive and Transportation Electronics Optical, Datacom and Telecom

Function:

Bonding Encapsulation Sealing

Available Packaging

Please call the technical team at
1-978-667-3805 to discuss packaging options.

Related Products

Viewing options:

EPO-TEK® HYB-353ND-LV

Low Viscosity UV Hybrid Epoxy

A single component, high temperature hybrid epoxy for semiconductor and fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking. It is a lower viscosity version of...

SDS TDS

70-3812NC

Aluminum Filled Epoxy

Aluminum filled epoxy with excellent thermal conductivity that passes ASTM E595 NASA low outgassing.

TDS

EPO-TEK® 323LP

High Temperature Optical Epoxy

Long pot life, high temperature epoxy designed for semiconductor, hybrid, fiber, and optical applications. Fiber optic adhesive designed to meet Telecordia 1221.

TDS

EPO-TEK® H20E-HC

High Thermal Conductivity Epoxy

High thermal conductivity version of EPO-TEK® H20E.

SDS TDS

EPO-TEK® OG142-87

Fiber Optic Epoxy Adhesive

Single component, low viscosity, UV curable epoxy for adhesive sealing and encapsulating fiber optic and optoelectronic packaging application.

TDS