Features
- Low Halogen & Green chemistry
- Maintains a long workable viscosity at room temperature and can be cured at 80°C in as little as 30 minutes.
- High Tg is designed to provide high strength at elevated temperatures
Applications
- Fiber Optics: Fiber Ferrule
- Optoelectronics: Optical components sub-assembly
- Piezo Electric Bonding
- LiDARs/IR Sensors
- Motors and Inductor Coils: Insulating copper coil windings
Certifications
Available Packaging
Please call the technical team at
1-978-667-3805 to discuss packaging options.

Related Products

EPO-TEK® OE121 Black
Underfill Epoxy Adhesive
Low temperature curing epoxy adhesive designed for semiconductor flip chip underfill. It is color coded black for visual ID during the underfilling process. It may also be used for adhesive, potting, sealing, and encapsulation applications found within the...

EPO-TEK® 353NDP
Hi-Rel Optical Epoxy
Meet the next generation of high-performance solutions. EPO-TEK® 353NDP takes reliability, durability, and efficiency to unprecedented levels—crafted for the challenges of the AI and Machine Learning era, and critical industries like Datacom & Telecom, Defense, Aerospace, and Automotive. ...

EPO-TEK® 353ND
Low Outgassing Optical Epoxy
High Temperature Resistance & Low outgassing Epoxy Meeting NASA ASTM E595 & Telcordia GR-1221.

10-2055 Series
Thixotropic Adhesive for High CTE Substrates
General purpose, semi flexible thixotropic adhesives for high CTEsubstrates available in either a light or heavy paste.

EPO-TEK® 353ND-T
Thixotropic Optical Epoxy Adhesive
Highly thixotropic epoxy with non-flowing properties and high temperature resistance.

EPO-TEK® 320
Thixotropic Optical Epoxy Adhesive
Black-colored and optically opaque epoxy designed for optical and optoelectronic packaging of semiconductor devices and components. It is a widely used fiber-optic grade epoxy.
EPO-TEK® OE121 Black
Underfill Epoxy Adhesive
Low temperature curing epoxy adhesive designed for semiconductor flip chip underfill. It is color coded black for visual ID during the underfilling process. It may also be used for adhesive, potting, sealing, and encapsulation applications found within the...
EPO-TEK® 353NDP
Hi-Rel Optical Epoxy
Meet the next generation of high-performance solutions. EPO-TEK® 353NDP takes reliability, durability, and efficiency to unprecedented levels—crafted for the challenges of the AI and Machine Learning era, and critical industries like Datacom & Telecom, Defense, Aerospace, and Automotive. ...
EPO-TEK® 353ND
Low Outgassing Optical Epoxy
High Temperature Resistance & Low outgassing Epoxy Meeting NASA ASTM E595 & Telcordia GR-1221.
10-2055 Series
Thixotropic Adhesive for High CTE Substrates
General purpose, semi flexible thixotropic adhesives for high CTEsubstrates available in either a light or heavy paste.
EPO-TEK® 353ND-T
Thixotropic Optical Epoxy Adhesive
Highly thixotropic epoxy with non-flowing properties and high temperature resistance.
EPO-TEK® 320
Thixotropic Optical Epoxy Adhesive
Black-colored and optically opaque epoxy designed for optical and optoelectronic packaging of semiconductor devices and components. It is a widely used fiber-optic grade epoxy.


Get in touch to learn more
Speak to us on 1-978-667-3805
Contact us
EPO-TEK® 343ND-LH
Optical Epoxy AdhesiveLet's talk
We're here to help you create the perfect product.

















