EPO-TEK® 353ND-T

Features

Downloads

Type

Document Name

File Size

Technical Data Sheet

Document Name EPO-TEK® 353ND-T TDS

File Size 600.8 KB

View

Safety Data Sheet

Document Name EPO-TEK® 353ND-T SDS

File Size 1.1 MB

View

Safety Data Sheet

Document Name EPO-TEK® 353ND-T Syringe SDS

File Size 909.9 KB

View

Brand:

Epoxy Technology

Technology:

Epoxy

Application:

Datacom and Telecom Microelectronics/Semiconductors Optical Sensors and Camera Modules

Market:

Electronics Optical, Datacom and Telecom

Function:

Bonding Sealing

Available Packaging

Please call the technical team at
1-978-667-3805 to discuss packaging options.

Related Products

Viewing options:

EPO-TEK® EK1000

Conductive Silver Filled Adhesive

High thermal conductive silver filled adhesive.

SDS TDS

EPO-TEK® OG142-87

Fiber Optic Epoxy Adhesive

Single component, low viscosity, UV curable epoxy for adhesive sealing and encapsulating fiber optic and optoelectronic packaging application.

TDS

EPO-TEK® HYB-353ND-HV

UV Hybrid Curing Epoxy

A single component, high temperature epoxy for semiconductor, hybrid, and fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking. It is a higher viscosity version of...

SDS TDS

EPO-TEK® HYB-353ND-LV

Low Viscosity UV Hybrid Epoxy

A single component, high temperature hybrid epoxy for semiconductor and fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking. It is a lower viscosity version of...

SDS TDS

EPO-TEK® 301

Low Viscosity Optical Grade Epoxy

Room temperature curing epoxy featuring very low viscosity, clear and excellence optical-mechanical properties.

TDS